Selective epitaxial growth technology has been extended to the base formation of a transistor on the basis of the SATURN (Self-Alignment Technology Utilizing Reserved Nitride) process, a high-speed bipolar LSI processing technology. The formation of a self-aligned base contact, coupled with SIC (Selective Ion-implanted Collector) fabricated by lowenergy ion implantation, has not only narrowed the transistor active regions but has drastically reduced the base width. A final base width of 800 and a maximum cut-off frequency of 31 GHz were achieved.

SiGe HBTs with doping level inversion, that is, a higher dopant concentration in the base than in the emitter, are realized based on the double-polysilicon self-aligned transistor scheme by means of selective epitaxy performed in a production CVD reactor. The effects of the Ge profile in the base on the transistor performance are explored. The fabricated HBT with a 12-27% graded Ge profile demonstrates a maximum cutoff frequency of 88 GHz, a maximum oscillation frequency of 65 GHz, and an ECL gate delay time of 13.8 ps.

We have developed the Epi-Base SATURN process as a silicon bipolar process technology which can be applied to optical transmission LSIs. This process technology, to which low temperature selective epitaxial growth technology is applied, is based on the SATURN process. By performing selective epitaxial growth for base formation in 2 steps, transistors with a 40GHz maximum cut-off frequency have been fabricated. In circuit simulation based on SPICE parameters of transistors, the target performance required for 2.4 Gbit/s optical interface LSIs has been achieved.