A method to improve the efficiency of dynamic fault imaging (DFI) by fully utilizing the CAD data in the CAD-linked electron beam test system is proposed. In the method, in order to shorten the long acquisition time of the stroboscopic voltage contrast images over the whole area of the chip during the entire test cycle, only the area and phase (time) required for fault tracing are selected by utilizing the CAD data. Furthermore, image processing techniques are combined with the method to improve the efficiency of the DFI. In particular, the signal averaging technique is used in order to improve the signal-to-noise ratio in the stroboscopic images where all voltage information data on the equipotential electrode recognized by the CAD layout data are averaged. This enables us to reduce the acquisition time of images. Moreover, the experimental system is set up so that the image processing can be performed in parallel with the acquisition of the stroboscopic images. The proposed method is applied to part of a 2k-transistor block of a nonpassivated CMOS LSI where a marginal fault is detected. The result shows that the method is an efficient approach to the fully automatic fault diagnosis in the CAD-linked electron beam test system. The proposed method could improve the efficiency of the conventional DFI by a factor of more than 1000.