We propose a three-dimensional structure on a planar substrate employing micromachining technology. A low-loss suspended structure incorporating a BCB membrane employing deep trench etching technology has been newly proposed. A micromachined suspended line structure using BCB membrane film enables us to realize a low loss planar resonator, which achieved an unloaded quality factor (Q-factor) of more than 280 at 60 GHz. We design low-loss filters and antennas built into silicon in a 60 GHz band. A low-loss filter realizes an insertion loss of 1.0 dB at 60 GHz and a patch antenna obtains a 3% bandwidth. In addition, we demonstrate a 60 GHz receiver front-end IC incorporating the planar filter and the antenna, and obtain good results. These techniques enable us to integrate various functions into a compact package even in millimeter-wave bands.

This paper describes a new millimeter-wave hybrid integrated circuit (HIC) technology which applies a thin film multi-layered dielectric substrate and flip-chip bonding technology employing stud bump bonding (SBB). We have previously proposed and demonstrated a novel HIC structure, named millimeter-wave flip-chip IC, (MFIC), applying an excellent dielectric material of benzocyclobutene (BCB) thin film and flip-chip bonding. In this paper, an advanced thin film multi-layer process using non-photosensitive BCB was newly developed. Characteristics of the transmission lines and the built-in MIM capacitor within the multi-layered structure were discussed. Furthermore, stud bump bonding was newly adapted to the MFIC as a flip-chip method, and the millimeter-wave characteristics of the bumps were examined. Using these technologies, we demonstrate characteristics of a miniaturized 25 GHz down converter MFIC. Our newly proposed HIC structure enabled us to bring down chip size to less than 1/3 of our conventional structure. Finally, we discuss future possibilities for high performance multi-chip-modules (MCMs) using SBB technology as a further improved HIC for compact millimeter-wave radio equipment.