A DRAM-cell array with 12-F2 twin cell was developed and evaluated in terms of speed, retention time, and low-voltage operation. The write and read-out times of the twin-cell array are shorter than those of a single-cell array by 70% and 40% respectively, because of parallel writing and reading of half charge to and from two memory cells. According to measured retention characteristics of the single cells, the twin-cell array improves retention time by 20% compared with the single-cell array at 1 V and keeps the retention time of the single-cell array at 0.4 V. Furthermore, the cell accepts the plate-driven scheme without the need of a dummy cell, lowering the necessary word-line voltage by 0.4 V.

A small data-line-swing read/write scheme is described for half-Vcc plate nonvolatile DRAMs with ferroelectric capacitors designed to achieve high reliability for read/write operations. In this scheme, the normal read/write operation holds the data as a charge with a small data-line-swing, and the store operation provides sufficient polarization with a full data-line-swing. This scheme enables high read/write endurance, because the small data-line-swing reduces the fatigue of the ferroelectric capacitor. Two circuit technologies are used in this scheme to increase the operating margin. The first is a plate voltage control technique that solves the polarization retention problem of half-Vcc plate nonvolatile DRAM technologies. The second is a doubled data-line-capacitance recall technique that connects two data lines to a cell and enlarges the readout signal compared to normal operation, when only one data line is connected to a cell. These techniques and circuits improve the write-cycle endurance by almost three orders of magnitude, while reducing the array power consumption during read/write operations to one-third that of conventional nonvolatile DRAMs.

To improve the stability and the power supply rejection ratio (PSRR) of the voltage limiter circuit used in high-density DRAM's we present a voltage limiter circuit with pole-zero compensation. Analytical expressions that describe the stability of the circuit are provided for comprehensive consideration of circuit design. Voltage limiters with pole-zero compensation are shown to have excellent performance with respect to the stability, PSRR, and circuit area occupation. The parasitic resistances in internal voltage supply lines, signal transmission lines, and transistors are important parameters determining the stability of pole-zero compensation. Evaluation of a 16-Mbit test device revealed internal voltage fluctuations of 6% during operation of a chip-internal circuit, a phase margin of 53, and a PSRR of 30 dB.