We present a new technique for hierarchical intellectual property (IP) protection using partially-mergeable cores. The proposed core partitioning technique guarantees 100% protection of critical-IP, while simplifying test generation for the logic that is merged with the system. Since critical-IP is tested using BIST, the controllability and observability of internal lines in the core are enhanced, and test application time is reduced. Case studies using the ISIT-DLX and Picojava processor cores demonstrate the applicability of our technique.

Rapid advances in semiconductor manufacturing technology have led to higher chip power densities, which places greater emphasis on packaging and temperature control during testing. For system-on-chips, peak power-based scheduling algorithms have been used to optimize tests under specified power constraints. However, imposing power constraints does not always solve the problem of overheating due to the non-uniform distribution of power across the chip. This paper presents a TAM/Wrapper co-design methodology for system-on-chips that ensures thermal safety while still optimizing the test schedule. The method combines a simplified thermal-cost model with a traditional bin-packing algorithm to minimize test time while satisfying temperature constraints. Furthermore, for temperature checking, thermal simulation is done using cycle-accurate power profiles for more realistic results. Experiments show that even a minimal sacrifice in test time can yield a considerable decrease in test temperature as well as the possibility of further lowering temperatures beyond those achieved using traditional power-based test scheduling.