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Junichi KODATE Mamoru UGAJIN Tsuneo TSUKAHARA Takakuni DOUSEKI Nobuhiko SATO Takehito OKABE Kazuaki OHMI Takao YONEHARA
The performance of radio frequency integrated circuits (RFICs) in silicon-on-insulator (SOI) technology can be improved by using a high-resistivity SOI substrate. We investigated the correlation between substrate resistivity and the performance of a low noise amplifier (LNA) on ELTRAN(R) SOI-Epi wafersTM, whose resistivity can be controlled precisely. The use of high-resistivity ELTRAN wafers improves the Q-factor of spiral inductors, and thereby increases the gain and narrows the bandwidth of the LNA. Using the high-resistivity ELTRAN wafers, we have successfully fabricated a 2.4-GHz and 5-GHz CMOS LNA in 0.35-µm SOI CMOS technology, whose process cost is lower than the latest CMOS technologies.