Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane

I-Fong CHEN; Chai-Mei PENG; Ching-Wen HSUE

doi:10.1093/ietcom/e88-b.4.1748

Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane

I-Fong CHEN, Chai-Mei PENG, Ching-Wen HSUE

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This paper presents an analytical model for the electromagnetic radiation in multi-microstrip lines covering the frequency range from 30 MHz to 1 GHz. The radiated emissions of multi-microstrip structure can be divided into the summation of radiated emissions of multi-individual microstrip structures. It is done by modelling the imperfect ground effect of the PCBs. Here we present a circuit model based on traditional transmission lines (TMLs) model. For more accurate analysis of the imperfect ground effect in multi-microstrip lines, we will divide the equivalent circuit model into N sections, based on transverse electromagnetic (TEM) assumption, to estimate the electromagnetic interference (EMI) of multi-microstrip lines. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground trace. Measured data are presented to confirm the results of numerical analysis and the computer simulations with a software package based on the Finite Element Method. A knowledge of EMI source mechanism and their relationship to layout geometries is necessary to determine the essential features that must be modelled to estimate emissions in PCBs design.

Publication: IEICE TRANSACTIONS on Communications Vol.E88-B No.4 pp.1748-1752

Publication Date: 2005/04/01

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DOI: 10.1093/ietcom/e88-b.4.1748

Type of Manuscript: LETTER

Category: Energy in Electronics Communications

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I-Fong CHEN, Chai-Mei PENG, Ching-Wen HSUE, "Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane" in IEICE TRANSACTIONS on Communications, vol. E88-B, no. 4, pp. 1748-1752, April 2005, doi: 10.1093/ietcom/e88-b.4.1748.
Abstract: This paper presents an analytical model for the electromagnetic radiation in multi-microstrip lines covering the frequency range from 30 MHz to 1 GHz. The radiated emissions of multi-microstrip structure can be divided into the summation of radiated emissions of multi-individual microstrip structures. It is done by modelling the imperfect ground effect of the PCBs. Here we present a circuit model based on traditional transmission lines (TMLs) model. For more accurate analysis of the imperfect ground effect in multi-microstrip lines, we will divide the equivalent circuit model into N sections, based on transverse electromagnetic (TEM) assumption, to estimate the electromagnetic interference (EMI) of multi-microstrip lines. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground trace. Measured data are presented to confirm the results of numerical analysis and the computer simulations with a software package based on the Finite Element Method. A knowledge of EMI source mechanism and their relationship to layout geometries is necessary to determine the essential features that must be modelled to estimate emissions in PCBs design.
URL: https://globals.ieice.org/en_transactions/communications/10.1093/ietcom/e88-b.4.1748/_p

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@ARTICLE{e88-b_4_1748,
author={I-Fong CHEN, Chai-Mei PENG, Ching-Wen HSUE, },
journal={IEICE TRANSACTIONS on Communications},
title={Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane},
year={2005},
volume={E88-B},
number={4},
pages={1748-1752},
abstract={This paper presents an analytical model for the electromagnetic radiation in multi-microstrip lines covering the frequency range from 30 MHz to 1 GHz. The radiated emissions of multi-microstrip structure can be divided into the summation of radiated emissions of multi-individual microstrip structures. It is done by modelling the imperfect ground effect of the PCBs. Here we present a circuit model based on traditional transmission lines (TMLs) model. For more accurate analysis of the imperfect ground effect in multi-microstrip lines, we will divide the equivalent circuit model into N sections, based on transverse electromagnetic (TEM) assumption, to estimate the electromagnetic interference (EMI) of multi-microstrip lines. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground trace. Measured data are presented to confirm the results of numerical analysis and the computer simulations with a software package based on the Finite Element Method. A knowledge of EMI source mechanism and their relationship to layout geometries is necessary to determine the essential features that must be modelled to estimate emissions in PCBs design.},
keywords={},
doi={10.1093/ietcom/e88-b.4.1748},
ISSN={},
month={April},}

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TY - JOUR
TI - Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane
T2 - IEICE TRANSACTIONS on Communications
SP - 1748
EP - 1752
AU - I-Fong CHEN
AU - Chai-Mei PENG
AU - Ching-Wen HSUE
PY - 2005
DO - 10.1093/ietcom/e88-b.4.1748
JO - IEICE TRANSACTIONS on Communications
SN -
VL - E88-B
IS - 4
JA - IEICE TRANSACTIONS on Communications
Y1 - April 2005
AB - This paper presents an analytical model for the electromagnetic radiation in multi-microstrip lines covering the frequency range from 30 MHz to 1 GHz. The radiated emissions of multi-microstrip structure can be divided into the summation of radiated emissions of multi-individual microstrip structures. It is done by modelling the imperfect ground effect of the PCBs. Here we present a circuit model based on traditional transmission lines (TMLs) model. For more accurate analysis of the imperfect ground effect in multi-microstrip lines, we will divide the equivalent circuit model into N sections, based on transverse electromagnetic (TEM) assumption, to estimate the electromagnetic interference (EMI) of multi-microstrip lines. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground trace. Measured data are presented to confirm the results of numerical analysis and the computer simulations with a software package based on the Finite Element Method. A knowledge of EMI source mechanism and their relationship to layout geometries is necessary to determine the essential features that must be modelled to estimate emissions in PCBs design.
ER -