LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation

Hiromu FUJIOKA; Koji NAKAMAE

LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation

Hiromu FUJIOKA, Koji NAKAMAE

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Following a discussion of various testing methods used in the electron beam (EB) test system, new waveform-based and image-based approaches in the CAD-linked electron beam (EB) test system are proposed. A waveform-based automatic tracing algorithm of the transistor-level performance faults is first discussed. Then, the method to improve the efficiency of an image-based method called dynamic fault imaging (DFI) by fully utilizing the CAD data is described. Third, the VLSI development cost is analyzed by using the fault models that make possible to take into consideration the effect of new testing technologies such as EB testing and focused ion beam (FIB) microfabrication. Finally, the future prospects are discussed.

Publication: IEICE TRANSACTIONS on Electronics Vol.E77-C No.4 pp.535-545

Publication Date: 1994/04/25

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Type of Manuscript: Special Section INVITED PAPER (Special Issue on LSI Failure Analysis)

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Hiromu FUJIOKA, Koji NAKAMAE, "LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation" in IEICE TRANSACTIONS on Electronics, vol. E77-C, no. 4, pp. 535-545, April 1994, doi: .
Abstract: Following a discussion of various testing methods used in the electron beam (EB) test system, new waveform-based and image-based approaches in the CAD-linked electron beam (EB) test system are proposed. A waveform-based automatic tracing algorithm of the transistor-level performance faults is first discussed. Then, the method to improve the efficiency of an image-based method called dynamic fault imaging (DFI) by fully utilizing the CAD data is described. Third, the VLSI development cost is analyzed by using the fault models that make possible to take into consideration the effect of new testing technologies such as EB testing and focused ion beam (FIB) microfabrication. Finally, the future prospects are discussed.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e77-c_4_535/_p

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@ARTICLE{e77-c_4_535,
author={Hiromu FUJIOKA, Koji NAKAMAE, },
journal={IEICE TRANSACTIONS on Electronics},
title={LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation},
year={1994},
volume={E77-C},
number={4},
pages={535-545},
abstract={Following a discussion of various testing methods used in the electron beam (EB) test system, new waveform-based and image-based approaches in the CAD-linked electron beam (EB) test system are proposed. A waveform-based automatic tracing algorithm of the transistor-level performance faults is first discussed. Then, the method to improve the efficiency of an image-based method called dynamic fault imaging (DFI) by fully utilizing the CAD data is described. Third, the VLSI development cost is analyzed by using the fault models that make possible to take into consideration the effect of new testing technologies such as EB testing and focused ion beam (FIB) microfabrication. Finally, the future prospects are discussed.},
keywords={},
doi={},
ISSN={},
month={April},}

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TY - JOUR
TI - LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation
T2 - IEICE TRANSACTIONS on Electronics
SP - 535
EP - 545
AU - Hiromu FUJIOKA
AU - Koji NAKAMAE
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 1994
AB - Following a discussion of various testing methods used in the electron beam (EB) test system, new waveform-based and image-based approaches in the CAD-linked electron beam (EB) test system are proposed. A waveform-based automatic tracing algorithm of the transistor-level performance faults is first discussed. Then, the method to improve the efficiency of an image-based method called dynamic fault imaging (DFI) by fully utilizing the CAD data is described. Third, the VLSI development cost is analyzed by using the fault models that make possible to take into consideration the effect of new testing technologies such as EB testing and focused ion beam (FIB) microfabrication. Finally, the future prospects are discussed.
ER -