A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (VCSEL) Array for Optical Interconnection

Ichiro OGURA; Kaori KURIHARA; Shigeru KAWAI; Mikihiro KAJITA; Kenichi KASAHARA

A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (VCSEL) Array for Optical Interconnection

Ichiro OGURA, Kaori KURIHARA, Shigeru KAWAI, Mikihiro KAJITA, Kenichi KASAHARA

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We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.

Publication: IEICE TRANSACTIONS on Electronics Vol.E78-C No.1 pp.22-27

Publication Date: 1995/01/25

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Type of Manuscript: Special Section INVITED PAPER (Special Issue on Ultrafast Optoelectronics)

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Ichiro OGURA, Kaori KURIHARA, Shigeru KAWAI, Mikihiro KAJITA, Kenichi KASAHARA, "A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (VCSEL) Array for Optical Interconnection" in IEICE TRANSACTIONS on Electronics, vol. E78-C, no. 1, pp. 22-27, January 1995, doi: .
Abstract: We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e78-c_1_22/_p

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@ARTICLE{e78-c_1_22,
author={Ichiro OGURA, Kaori KURIHARA, Shigeru KAWAI, Mikihiro KAJITA, Kenichi KASAHARA, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (VCSEL) Array for Optical Interconnection},
year={1995},
volume={E78-C},
number={1},
pages={22-27},
abstract={We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.},
keywords={},
doi={},
ISSN={},
month={January},}

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TY - JOUR
TI - A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (VCSEL) Array for Optical Interconnection
T2 - IEICE TRANSACTIONS on Electronics
SP - 22
EP - 27
AU - Ichiro OGURA
AU - Kaori KURIHARA
AU - Shigeru KAWAI
AU - Mikihiro KAJITA
AU - Kenichi KASAHARA
PY - 1995
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E78-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 1995
AB - We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.
ER -