High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs

Hiroyuki SAKAI; Takayuki YOSHIDA; Morikazu SAGAWA

High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs

Hiroyuki SAKAI, Takayuki YOSHIDA, Morikazu SAGAWA

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This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.

Publication: IEICE TRANSACTIONS on Electronics Vol.E81-C No.6 pp.810-818

Publication Date: 1998/06/25

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Type of Manuscript: Special Section INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)

Category: Functional Modules and the Design Technology

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Hiroyuki SAKAI, Takayuki YOSHIDA, Morikazu SAGAWA, "High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs" in IEICE TRANSACTIONS on Electronics, vol. E81-C, no. 6, pp. 810-818, June 1998, doi: .
Abstract: This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e81-c_6_810/_p

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@ARTICLE{e81-c_6_810,
author={Hiroyuki SAKAI, Takayuki YOSHIDA, Morikazu SAGAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs},
year={1998},
volume={E81-C},
number={6},
pages={810-818},
abstract={This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.},
keywords={},
doi={},
ISSN={},
month={June},}

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TY - JOUR
TI - High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
T2 - IEICE TRANSACTIONS on Electronics
SP - 810
EP - 818
AU - Hiroyuki SAKAI
AU - Takayuki YOSHIDA
AU - Morikazu SAGAWA
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E81-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1998
AB - This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.
ER -