Contact Behaviors of New Material for Micro Relays

Terutaka TAMAI; Tatsumi IDE

Contact Behaviors of New Material for Micro Relays

Terutaka TAMAI, Tatsumi IDE

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Ag(40 wt%)-Pd(60 wt%) alloy has been widely applied to contact materials installed in various electromechanical devices. However, in application to the down sized relays, failure due to contact resistance is caused easily by both growth of oxide film on the contact surface and low contact force. To solve the increase in contact resistance, an overlay of thin Au or thin Au-Ag (8-10 wt%) has been used on the alloy. Despite this, cleanliness and low hardness of these overlays cause adhesion, or sticking, at contact interface. Increase in contact resistance and sticking are contrary to each other. In order to eliminate these contrary properties, the author studied improving the Ag-Pd alloy with a dopant. Low level of contact resistance for both static and dynamic contacts of Ag-Pd with Mg doping was found even if the contact surface was covered with an oxide contaminant film. This paper presents the excellent contact resistance and adhesion behaviors of Ag-Pd-Mg alloy and their mechanisms, and also presents in the later part, surface contamination behaviors for organic gases.

Publication: IEICE TRANSACTIONS on Electronics Vol.E87-C No.8 pp.1235-1240

Publication Date: 2004/08/01

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Type of Manuscript: Special Section PAPER (Special Section on IS-EMD2003--Recent Technical Trend of Electro-Mechanical Devices)

Category: New Technology and Automotive Applications

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Terutaka TAMAI, Tatsumi IDE, "Contact Behaviors of New Material for Micro Relays" in IEICE TRANSACTIONS on Electronics, vol. E87-C, no. 8, pp. 1235-1240, August 2004, doi: .
Abstract: Ag(40 wt%)-Pd(60 wt%) alloy has been widely applied to contact materials installed in various electromechanical devices. However, in application to the down sized relays, failure due to contact resistance is caused easily by both growth of oxide film on the contact surface and low contact force. To solve the increase in contact resistance, an overlay of thin Au or thin Au-Ag (8-10 wt%) has been used on the alloy. Despite this, cleanliness and low hardness of these overlays cause adhesion, or sticking, at contact interface. Increase in contact resistance and sticking are contrary to each other. In order to eliminate these contrary properties, the author studied improving the Ag-Pd alloy with a dopant. Low level of contact resistance for both static and dynamic contacts of Ag-Pd with Mg doping was found even if the contact surface was covered with an oxide contaminant film. This paper presents the excellent contact resistance and adhesion behaviors of Ag-Pd-Mg alloy and their mechanisms, and also presents in the later part, surface contamination behaviors for organic gases.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e87-c_8_1235/_p

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@ARTICLE{e87-c_8_1235,
author={Terutaka TAMAI, Tatsumi IDE, },
journal={IEICE TRANSACTIONS on Electronics},
title={Contact Behaviors of New Material for Micro Relays},
year={2004},
volume={E87-C},
number={8},
pages={1235-1240},
abstract={Ag(40 wt%)-Pd(60 wt%) alloy has been widely applied to contact materials installed in various electromechanical devices. However, in application to the down sized relays, failure due to contact resistance is caused easily by both growth of oxide film on the contact surface and low contact force. To solve the increase in contact resistance, an overlay of thin Au or thin Au-Ag (8-10 wt%) has been used on the alloy. Despite this, cleanliness and low hardness of these overlays cause adhesion, or sticking, at contact interface. Increase in contact resistance and sticking are contrary to each other. In order to eliminate these contrary properties, the author studied improving the Ag-Pd alloy with a dopant. Low level of contact resistance for both static and dynamic contacts of Ag-Pd with Mg doping was found even if the contact surface was covered with an oxide contaminant film. This paper presents the excellent contact resistance and adhesion behaviors of Ag-Pd-Mg alloy and their mechanisms, and also presents in the later part, surface contamination behaviors for organic gases.},
keywords={},
doi={},
ISSN={},
month={August},}

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TY - JOUR
TI - Contact Behaviors of New Material for Micro Relays
T2 - IEICE TRANSACTIONS on Electronics
SP - 1235
EP - 1240
AU - Terutaka TAMAI
AU - Tatsumi IDE
PY - 2004
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E87-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2004
AB - Ag(40 wt%)-Pd(60 wt%) alloy has been widely applied to contact materials installed in various electromechanical devices. However, in application to the down sized relays, failure due to contact resistance is caused easily by both growth of oxide film on the contact surface and low contact force. To solve the increase in contact resistance, an overlay of thin Au or thin Au-Ag (8-10 wt%) has been used on the alloy. Despite this, cleanliness and low hardness of these overlays cause adhesion, or sticking, at contact interface. Increase in contact resistance and sticking are contrary to each other. In order to eliminate these contrary properties, the author studied improving the Ag-Pd alloy with a dopant. Low level of contact resistance for both static and dynamic contacts of Ag-Pd with Mg doping was found even if the contact surface was covered with an oxide contaminant film. This paper presents the excellent contact resistance and adhesion behaviors of Ag-Pd-Mg alloy and their mechanisms, and also presents in the later part, surface contamination behaviors for organic gases.
ER -