PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators

Jonghumn BAEK; Yongjin JEONG; Seokyoon KIM

PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators

Jonghumn BAEK, Yongjin JEONG, Seokyoon KIM

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This paper proposes a PCB plane model for generic circuit simulators (SPICE). The proposed model reflects two frequency-dependent losses, namely, skin and dielectric losses. Once power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and the loss model. The loss model is composed of a resistor for DC loss, series RL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements only.

Publication: IEICE TRANSACTIONS on Electronics Vol.E87-C No.8 pp.1388-1394

Publication Date: 2004/08/01

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Type of Manuscript: LETTER

Category: Electromechanical Devices and Components

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Jonghumn BAEK, Yongjin JEONG, Seokyoon KIM, "PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators" in IEICE TRANSACTIONS on Electronics, vol. E87-C, no. 8, pp. 1388-1394, August 2004, doi: .
Abstract: This paper proposes a PCB plane model for generic circuit simulators (SPICE). The proposed model reflects two frequency-dependent losses, namely, skin and dielectric losses. Once power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and the loss model. The loss model is composed of a resistor for DC loss, series RL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements only.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e87-c_8_1388/_p

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@ARTICLE{e87-c_8_1388,
author={Jonghumn BAEK, Yongjin JEONG, Seokyoon KIM, },
journal={IEICE TRANSACTIONS on Electronics},
title={PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators},
year={2004},
volume={E87-C},
number={8},
pages={1388-1394},
abstract={This paper proposes a PCB plane model for generic circuit simulators (SPICE). The proposed model reflects two frequency-dependent losses, namely, skin and dielectric losses. Once power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and the loss model. The loss model is composed of a resistor for DC loss, series RL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements only.},
keywords={},
doi={},
ISSN={},
month={August},}

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TY - JOUR
TI - PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators
T2 - IEICE TRANSACTIONS on Electronics
SP - 1388
EP - 1394
AU - Jonghumn BAEK
AU - Yongjin JEONG
AU - Seokyoon KIM
PY - 2004
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E87-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2004
AB - This paper proposes a PCB plane model for generic circuit simulators (SPICE). The proposed model reflects two frequency-dependent losses, namely, skin and dielectric losses. Once power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and the loss model. The loss model is composed of a resistor for DC loss, series RL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements only.
ER -