Contact Resistance Property of Gold Plated Contact Covered with Contact Lubricant Under High Temperature

Terutaka TAMAI; Masahiro YAMAKAWA

doi:10.1587/transele.E100.C.702

Contact Resistance Property of Gold Plated Contact Covered with Contact Lubricant Under High Temperature

Terutaka TAMAI, Masahiro YAMAKAWA

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At the present time, as downsizing of connectors causes thin gold plated layer and low contact load, serious problem of degradation of contact resistance property is induced. For these contacts, corrosion of the contacts surface under environment and high temperature as soldering and reflow process should be existed. Oxidation of base metal atoms which are diffused from under layer and additives occurs. Contact resistance increases for both surface contamination and low contact load. In order to resolve these problems and wear of surface, application of contact lubricants is useful and effective. However, degradation of the lubricants under such reflow process as high temperature possibly occurs. Therefore, in this study, from view point of change of lubricant quality as viscosity, weight loss, polymerization, oxidation and molecular orientation were clarified. For increase in contact resistance, orientation of lubricant molecular acts as important factor was found. The other factors of the lubricant hardly does not effect on contact resistance.

Publication: IEICE TRANSACTIONS on Electronics Vol.E100-C No.9 pp.702-708

Publication Date: 2017/09/01

Publicized

Online ISSN: 1745-1353

DOI: 10.1587/transele.E100.C.702

Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices)

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Authors

Terutaka TAMAI
Elcontec Consulting, Ltd.
Masahiro YAMAKAWA
TETRA Co. Ltd.

Keyword

contact lubricants, gold plating, olefin, contact resistance, molecular orientation

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Terutaka TAMAI, Masahiro YAMAKAWA, "Contact Resistance Property of Gold Plated Contact Covered with Contact Lubricant Under High Temperature" in IEICE TRANSACTIONS on Electronics, vol. E100-C, no. 9, pp. 702-708, September 2017, doi: 10.1587/transele.E100.C.702.
Abstract: At the present time, as downsizing of connectors causes thin gold plated layer and low contact load, serious problem of degradation of contact resistance property is induced. For these contacts, corrosion of the contacts surface under environment and high temperature as soldering and reflow process should be existed. Oxidation of base metal atoms which are diffused from under layer and additives occurs. Contact resistance increases for both surface contamination and low contact load. In order to resolve these problems and wear of surface, application of contact lubricants is useful and effective. However, degradation of the lubricants under such reflow process as high temperature possibly occurs. Therefore, in this study, from view point of change of lubricant quality as viscosity, weight loss, polymerization, oxidation and molecular orientation were clarified. For increase in contact resistance, orientation of lubricant molecular acts as important factor was found. The other factors of the lubricant hardly does not effect on contact resistance.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/transele.E100.C.702/_p

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@ARTICLE{e100-c_9_702,
author={Terutaka TAMAI, Masahiro YAMAKAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Contact Resistance Property of Gold Plated Contact Covered with Contact Lubricant Under High Temperature},
year={2017},
volume={E100-C},
number={9},
pages={702-708},
abstract={At the present time, as downsizing of connectors causes thin gold plated layer and low contact load, serious problem of degradation of contact resistance property is induced. For these contacts, corrosion of the contacts surface under environment and high temperature as soldering and reflow process should be existed. Oxidation of base metal atoms which are diffused from under layer and additives occurs. Contact resistance increases for both surface contamination and low contact load. In order to resolve these problems and wear of surface, application of contact lubricants is useful and effective. However, degradation of the lubricants under such reflow process as high temperature possibly occurs. Therefore, in this study, from view point of change of lubricant quality as viscosity, weight loss, polymerization, oxidation and molecular orientation were clarified. For increase in contact resistance, orientation of lubricant molecular acts as important factor was found. The other factors of the lubricant hardly does not effect on contact resistance.},
keywords={},
doi={10.1587/transele.E100.C.702},
ISSN={1745-1353},
month={September},}

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TY - JOUR
TI - Contact Resistance Property of Gold Plated Contact Covered with Contact Lubricant Under High Temperature
T2 - IEICE TRANSACTIONS on Electronics
SP - 702
EP - 708
AU - Terutaka TAMAI
AU - Masahiro YAMAKAWA
PY - 2017
DO - 10.1587/transele.E100.C.702
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E100-C
IS - 9
JA - IEICE TRANSACTIONS on Electronics
Y1 - September 2017
AB - At the present time, as downsizing of connectors causes thin gold plated layer and low contact load, serious problem of degradation of contact resistance property is induced. For these contacts, corrosion of the contacts surface under environment and high temperature as soldering and reflow process should be existed. Oxidation of base metal atoms which are diffused from under layer and additives occurs. Contact resistance increases for both surface contamination and low contact load. In order to resolve these problems and wear of surface, application of contact lubricants is useful and effective. However, degradation of the lubricants under such reflow process as high temperature possibly occurs. Therefore, in this study, from view point of change of lubricant quality as viscosity, weight loss, polymerization, oxidation and molecular orientation were clarified. For increase in contact resistance, orientation of lubricant molecular acts as important factor was found. The other factors of the lubricant hardly does not effect on contact resistance.
ER -