Multilayer Four-Way Out-of-Phase Power Divider Based on Substrate Integrated Waveguide Technology

Zhitao XU; Jun XU; Shuai LIU; Yaping ZHANG

doi:10.1587/transele.E99.C.895

Multilayer Four-Way Out-of-Phase Power Divider Based on Substrate Integrated Waveguide Technology

Zhitao XU, Jun XU, Shuai LIU, Yaping ZHANG

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In this paper, a novel multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is proposed. It is realized by 3D mode coupling, on multilayer substrates. The structure consists of vertical Y-junction, lateral T-junction of SIW and lateral Y-junction of half-mode SIW. The advantages of the proposed structure are its low cost and ease of fabrication. Also, it can be integrated easily with other planar circuits such as microstrip circuits. An experimental circuit is designed and fabricated using the traditional printed circuit board technology. The simulated and measured results show that the return loss of the input port is above 15 dB over 8 to 11.8 GHz and transmissions are about -7.6±1.6 dB in the passband. It is expected that the proposed the proposed power divider will play an important role in the future integration of compact multilayer SIW circuits and systems.

Publication: IEICE TRANSACTIONS on Electronics Vol.E99-C No.7 pp.895-898

Publication Date: 2016/07/01

Publicized

Online ISSN: 1745-1353

DOI: 10.1587/transele.E99.C.895

Type of Manuscript: BRIEF PAPER

Category: Microwaves, Millimeter-Waves

Authors

Zhitao XU
  University of Electronic Science and Technology of China
Jun XU
  University of Electronic Science and Technology of China
Shuai LIU
  University of Electronic Science and Technology of China
Yaping ZHANG
  University of Electronic Science and Technology of China

Keyword

multilayer substrate, powerdivider, out-of-phase, substrate integrated waveguide

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Zhitao XU, Jun XU, Shuai LIU, Yaping ZHANG, "Multilayer Four-Way Out-of-Phase Power Divider Based on Substrate Integrated Waveguide Technology" in IEICE TRANSACTIONS on Electronics, vol. E99-C, no. 7, pp. 895-898, July 2016, doi: 10.1587/transele.E99.C.895.
Abstract: In this paper, a novel multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is proposed. It is realized by 3D mode coupling, on multilayer substrates. The structure consists of vertical Y-junction, lateral T-junction of SIW and lateral Y-junction of half-mode SIW. The advantages of the proposed structure are its low cost and ease of fabrication. Also, it can be integrated easily with other planar circuits such as microstrip circuits. An experimental circuit is designed and fabricated using the traditional printed circuit board technology. The simulated and measured results show that the return loss of the input port is above 15 dB over 8 to 11.8 GHz and transmissions are about -7.6±1.6 dB in the passband. It is expected that the proposed the proposed power divider will play an important role in the future integration of compact multilayer SIW circuits and systems.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/transele.E99.C.895/_p

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@ARTICLE{e99-c_7_895,
author={Zhitao XU, Jun XU, Shuai LIU, Yaping ZHANG, },
journal={IEICE TRANSACTIONS on Electronics},
title={Multilayer Four-Way Out-of-Phase Power Divider Based on Substrate Integrated Waveguide Technology},
year={2016},
volume={E99-C},
number={7},
pages={895-898},
abstract={In this paper, a novel multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is proposed. It is realized by 3D mode coupling, on multilayer substrates. The structure consists of vertical Y-junction, lateral T-junction of SIW and lateral Y-junction of half-mode SIW. The advantages of the proposed structure are its low cost and ease of fabrication. Also, it can be integrated easily with other planar circuits such as microstrip circuits. An experimental circuit is designed and fabricated using the traditional printed circuit board technology. The simulated and measured results show that the return loss of the input port is above 15 dB over 8 to 11.8 GHz and transmissions are about -7.6±1.6 dB in the passband. It is expected that the proposed the proposed power divider will play an important role in the future integration of compact multilayer SIW circuits and systems.},
keywords={},
doi={10.1587/transele.E99.C.895},
ISSN={1745-1353},
month={July},}

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TY - JOUR
TI - Multilayer Four-Way Out-of-Phase Power Divider Based on Substrate Integrated Waveguide Technology
T2 - IEICE TRANSACTIONS on Electronics
SP - 895
EP - 898
AU - Zhitao XU
AU - Jun XU
AU - Shuai LIU
AU - Yaping ZHANG
PY - 2016
DO - 10.1587/transele.E99.C.895
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E99-C
IS - 7
JA - IEICE TRANSACTIONS on Electronics
Y1 - July 2016
AB - In this paper, a novel multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is proposed. It is realized by 3D mode coupling, on multilayer substrates. The structure consists of vertical Y-junction, lateral T-junction of SIW and lateral Y-junction of half-mode SIW. The advantages of the proposed structure are its low cost and ease of fabrication. Also, it can be integrated easily with other planar circuits such as microstrip circuits. An experimental circuit is designed and fabricated using the traditional printed circuit board technology. The simulated and measured results show that the return loss of the input port is above 15 dB over 8 to 11.8 GHz and transmissions are about -7.6±1.6 dB in the passband. It is expected that the proposed the proposed power divider will play an important role in the future integration of compact multilayer SIW circuits and systems.
ER -