A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder

Shengping JIANG; Hiroyuki ANZAI

A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder

Shengping JIANG, Hiroyuki ANZAI

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In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (x_k, y_k, z_k (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.

Publication: IEICE TRANSACTIONS on Fundamentals Vol.E75-A No.9 pp.1134-1140

Publication Date: 1992/09/25

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Type of Manuscript: PAPER

Category: Computer Aided Design (CAD)

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Shengping JIANG, Hiroyuki ANZAI, "A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder" in IEICE TRANSACTIONS on Fundamentals, vol. E75-A, no. 9, pp. 1134-1140, September 1992, doi: .
Abstract: In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (x_k, y_k, z_k (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.
URL: https://globals.ieice.org/en_transactions/fundamentals/10.1587/e75-a_9_1134/_p

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@ARTICLE{e75-a_9_1134,
author={Shengping JIANG, Hiroyuki ANZAI, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder},
year={1992},
volume={E75-A},
number={9},
pages={1134-1140},
abstract={In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (x_k, y_k, z_k (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.},
keywords={},
doi={},
ISSN={},
month={September},}

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TY - JOUR
TI - A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 1134
EP - 1140
AU - Shengping JIANG
AU - Hiroyuki ANZAI
PY - 1992
DO -
JO - IEICE TRANSACTIONS on Fundamentals
SN -
VL - E75-A
IS - 9
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - September 1992
AB - In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (x_k, y_k, z_k (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.
ER -