SO<SUB>2</SUB> Gas Corrosion and Contact Resistance Properties for the Contact Surface of Printed Circuit Board

Terutaka TAMA; Tsunemi MORIYA

SO₂ Gas Corrosion and Contact Resistance Properties for the Contact Surface of Printed Circuit Board

Terutaka TAMA, Tsunemi MORIYA

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Corrosion of contact surface on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in SO₂ environment. The corrosion was evaluated by contaminant film and contact resistance. The Au plated surface easily degraded. On the contrary, the film on the solder plated surface grew slowly. Acceptable low contact resistance was found.

Publication: IEICE TRANSACTIONS on transactions Vol.E72-E No.4 pp.293-295

Publication Date: 1989/04/25

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Type of Manuscript: Special Section LETTER (Special Issue on 1989 Spring National Convention IEICE)

Category: Components and Materials

Authors

Terutaka TAMA
Tsunemi MORIYA

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Terutaka TAMA, Tsunemi MORIYA, "SO2 Gas Corrosion and Contact Resistance Properties for the Contact Surface of Printed Circuit Board" in IEICE TRANSACTIONS on transactions, vol. E72-E, no. 4, pp. 293-295, April 1989, doi: .
Abstract: Corrosion of contact surface on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in SO₂ environment. The corrosion was evaluated by contaminant film and contact resistance. The Au plated surface easily degraded. On the contrary, the film on the solder plated surface grew slowly. Acceptable low contact resistance was found.
URL: https://globals.ieice.org/en_transactions/transactions/10.1587/e72-e_4_293/_p

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@ARTICLE{e72-e_4_293,
author={Terutaka TAMA, Tsunemi MORIYA, },
journal={IEICE TRANSACTIONS on transactions},
title={SO2 Gas Corrosion and Contact Resistance Properties for the Contact Surface of Printed Circuit Board},
year={1989},
volume={E72-E},
number={4},
pages={293-295},
abstract={Corrosion of contact surface on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in SO₂ environment. The corrosion was evaluated by contaminant film and contact resistance. The Au plated surface easily degraded. On the contrary, the film on the solder plated surface grew slowly. Acceptable low contact resistance was found.},
keywords={},
doi={},
ISSN={},
month={April},}

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TY - JOUR
TI - SO2 Gas Corrosion and Contact Resistance Properties for the Contact Surface of Printed Circuit Board
T2 - IEICE TRANSACTIONS on transactions
SP - 293
EP - 295
AU - Terutaka TAMA
AU - Tsunemi MORIYA
PY - 1989
DO -
JO - IEICE TRANSACTIONS on transactions
SN -
VL - E72-E
IS - 4
JA - IEICE TRANSACTIONS on transactions
Y1 - April 1989
AB - Corrosion of contact surface on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in SO₂ environment. The corrosion was evaluated by contaminant film and contact resistance. The Au plated surface easily degraded. On the contrary, the film on the solder plated surface grew slowly. Acceptable low contact resistance was found.
ER -