According to the process scaling, radiation-hard devices are becoming sensitive to soft errors caused by Multiple Cell Upset (MCUs). In this paper, the parasitic bipolar effects are utilized to suppress MCUs of the radiation-hard dual-modular flip-flops. Device simulations reveal that a simultaneous flip of redundant latches is suppressed by storing opposite values instead of storing the same value due to its asymmetrical structure. The state of latches becomes a specific value after a particle hit due to the bipolar effects. Spallation neutron irradiation proves that MCUs are effectively suppressed in the D-FF arrays in which adjacent two latches in different FFs store opposite values. The redundant latch structure storing the opposite values is robust to the simultaneous flip.

Cross sections that cause single event upsets by heavy ions are sensitive to doping concentration in the source and drain regions, and the structure of the raised source and drain regions especially in FDSOI. Due to the parasitic bipolar effect (PBE), radiation-hardened flip flops with stacked transistors in FDSOI tend to have soft errors, which is consistent with measurement results by heavy-ion irradiation. Device-simulation results in this study show that the cross section is proportional to the silicon thickness of the raised layer and inversely proportional to the doping concentration in the drain. Increasing the doping concentration in the source and drain region enhance the Auger recombination of carriers there and suppresses the parasitic bipolar effect. PBE is also suppressed by decreasing the silicon thickness of the raised layer. Cgg-Vgs and Ids-Vgs characteristics change smaller than soft error tolerance change. Soft error tolerance can be effectively optimized by using these two determinants with only a small impact on transistor characteristics.

We evaluated soft-error tolerance by heavy-ion irradiation test on three-types of flip-flops (FFs) named the standard FF (STDFF), the dual feedback recovery FF (DFRFF), and the DFRFF with long delay (DFRFFLD) in 22 and 65 nm fully-depleted silicon on insulator (FD-SOI) technologies. The guard-gate (GG) structure in DFRFF mitigates soft errors. A single event transient (SET) pulse is removed by the C-element with the signal delayed by the GG structure. DFRFFLD increases the GG delay by adding two more inverters as delay elements. We investigated the effectiveness of the GG structure in 22 and 65 nm. In 22 nm, Kr (40.3 MeV-cm2/mg) and Xe (67.2 MeV-cm2/mg) irradiation tests revealed that DFRFFLD has sufficient soft-error tolerance in outer space. In 65 nm, the relationship between GG delay and CS reveals the GG delay time which no error was observed under Kr irradiation.

Radiation-induced temporal errors become a significant issue for circuit reliability. We measured the pulse widths of radiation-induced single event transients (SETs) from pMOSFETs and nMOSFETs separately. Test results show that heavy-ion induced SET rates of nMOSFETs were twice as high as those of pMOSFETs and that neutron-induced SETs occurred only in nMOSFETs. It was confirmed that the SET distribution from inverter chains can be estimated using the SET distribution from pMOSFETs and nMOSFETs by considering the difference in load capacitance of the measurement circuits.

Integrated circuits used in automotive or aerospace applications must have high soft error tolerance. Redundant Flip Flops (FFs) are effective to improve the soft error tolerance. However, these countermeasures have large performance overheads and can be excessive for terrestrial applications. This paper proposes two types of radiation-hardened FFs named Primary Latch Transmission gate FF (PLTGFF) and Feed-Back Gate Tri-state Inverter FF (FBTIFF) for terrestrial use. By increasing the critical charge (Qcrit) at weak nodes, soft error tolerance of them were improved with low performance overheads. PLTGFF has the 5% area, 4% delay, and 10% power overheads, while FBTIFF has the 42% area, 10% delay, and 22% power overheads. They were fabricated in a 65 nm bulk process. By α-particle and spallation neutron irradiation tests, the soft error rates are reduced by 25% for PLTGFF and 50% for FBTIFF compared to a standard FF. In the terrestrial environment, the proposed FFs have better trade-offs between reliability and performance than those of multiplexed FFs such as the dual-interlocked storage cell (DICE) with larger overheads than the proposed FFs.

We measure neutron-induced Single Event Upsets (SEUs) and Multiple Cell Upsets (MCUs) on Flip-Flops (FFs) in a 65-nm bulk CMOS process in order to evaluate dependence of MCUs on cell distance and well-contact density using four different shift registers. Measurement results by accelerated tests show that MCU/SEU is up to 23.4% and it is exponentially decreased by the distance between latches on FFs. MCU rates can be drastically reduced by inserting well-contact arrays between FFs. The number of MCUs is reduced from 110 to 1 by inserting well-contact arrays under power and ground rails.

According to the process scaling, semiconductor devices are becoming more sensitive to soft errors since amount of critical charges are decreasing. In this paper, we propose an area/delay efficient dual modular flip-flop, which is tolerant to SEU (Single Event Upset) and SET (Single Event Transient). It is based on a "BISER" (Built-in Soft Error Resilience). The original BISER FF achieves small area but it is vulnerable to an SET pulse on C-elements. The proposed dual modular FF doubles C-elements and weak keepers between master and slave latches, which enhances SET immunity considerably with paying small area-delay product than the conventional delayed TMR FFs.

We show measurement results of variation-tolerance of an error-hardened dual-modular-redundancy flip-flop fabricated in a 65-nm process. The proposed error-hardened FF called BCDMR is very strong against soft errors and also robust to process variations. We propose a shift-register-based test structure to measure variations. The proposed test structure has features of constant pin count and fast measurement time. A 65 nm chip was fabricated including 40k FFs to measure variations. The variations of the proposed BCDMR FF are 74% and 55% smaller than those of the conventional BISER FF on the twin-well and triple-well structures respectively.

As device sizes are downscaled to nanometer, Random Telegraph Noise (RTN) becomes dominant. It is indispensable to accurately estimate the effect of RTN. We propose an RTN simulation method for analog circuits. It is based on the charge trapping model. The RTN-induced threshold voltage fluctuation are replicated to attach a variable DC voltage source to the gate of a MOSFET by using Verilog-AMS. In recent deca-nanometer processes, high-k (HK) materials are used in gate dielectrics to decrease the leakage current. We must consider the defect distribution characteristics both in HK and interface layer (IL). This RTN model can be applied to the bimodal model which includes characteristics of the HK and IL dielectrics. We confirm that the drain current of MOSFETs temporally fluctuates in circuit-level simulations. The fluctuations of RTN are different in MOSFETs. RTN affects the frequency characteristics of ring oscillators (ROs). The distribution of RTN-induced frequency fluctuations has a long-tail in a HK process. The RTN model applied to the bimodal can replicate a long-tail distribution. Our proposed method can estimate the temporal impact of RTN including multiple transistors.

We propose a radiation-hardened Flip-Flop (FF) with stacked transistors based on the Adaptive Coupling Flip-Flop (ACFF) with low power consumption in a 65 nm FDSOI process. The slave latch in ACFF is much weaker against soft errors than the master latch. We design several FFs with stacked transistors in the master or slave latches to mitigate soft errors. We investigate radiation hardness of the proposed FFs by α particle and neutron irradiation tests. The proposed FFs have higher radiation hardness than a conventional DFF and ACFF. Neutron irradiation and α particle tests revealed no error in the proposed AC Slave-Stacked FF (AC_SS FF) which has stacked transistors only in the slave latch. We also investigate radiation hardness of the proposed FFs by heavy ion irradiation. The proposed FFs maintain higher radiation hardness up to 40 MeV-cm2/mg than the conventional DFF. Stacked inverters become more sensitive to soft errors by increasing tilt angles. AC_SS FF achieves higher radiation hardness than ACFF with the performance equivalent to that of ACFF.