A method called "active guard band filtering" is proposed for reducing substrate noise in analog and digital mixed-signal integrated circuits. A noise cancellation signal having an inverse value to the substrate noise is actively input into a guard band to suppress the substrate noise. An operational amplifier produces the noise cancellation signal based upon the substrate noise detected by one guard band and feeds this signal through another quard band into the substrate. This is done within the amplifier feedback loop, which includes the guard bands and the substrate. The noise suppression effect was measured by using 0.8µm CMOS test chip. Using active guard band filtering suppressed substrate noise to -40 dB of the original non-canceled noise level at 8 MHz. The noise suppression effect was also observed at frequencies up to 20MHz, with an external operational amplifier. The influence of parasitic impedance was found to be a key factor in noise suppression. An active guard band filter with an on-chip noise cancellation circuit will be even more effective for high frequencies, because it eliminates parasitic impedance due to external components.

An AC coupling configuration for the active guard band filters is introduced for suppressing substrate coupling noise in analog and digital mixed-signal integrated circuits. With this method, a substrate-coupling-noise cancellation signal can be supplied to a ground-level substrate by using a single 3-V supply on-chip circuits. Noise was suppressed to a maximum of less than 0.05 from 100 Hz to 2 MHz in a 0.35-µm CMOS test chip. Both experiments and a simulation based on the substrate extraction model showed the similar dependence of the noise-suppression effect on the arrangement of the guard-bands and analog circuits. The simulation is thus effective for optimizing the arrangement to suppress noise effects when designing a chip.

Digital-switching noise coupled into sensitive analog circuits is a critical problem in large-scale integration of mixed analog and digital circuits. This paper describes noise coupling of this kind, especially, through the substrate in CMOS integrated circuits, and reviews recent technical solutions to this noise problem. Simplified models have been developed to simulate the substrate coupling rapidly and accurately. A method using a CMOS comparator was proposed for measuring the effects of substrate noise, and equivalent waveforms of actual substrate noise were obtained. A circuit tecnique, called active guard band filtering, that controls the noise source is a new approach to substrate noise decoupling. CAD methods for handling substrate-coupled switching noise are making design verification possible for practical mixed-signal LSIs.

This paper describes fully integrated active guard band filters for suppressing the substrate coupling noise and their noise suppression effect measured by test chip experiments. The noise cancellation circuit of the active guard band filters simply consists of an inverter and a source follower. The substrate noise suppression effect was measured by using a test chip fabricated in a 0.18 µm CMOS triple-well process for system-on-a-chip. The noise with the filter was less than 5% of that without the filter and the noise suppression effect was observed from 1 MHz to 200 MHz by the statistical measurement of the voltage comparator. The noise suppression effect was also observed for actual digital switching noise produced by digital inverters. Configuration of the active guard band filter was investigated by simulation and it is shown that high and uniform noise suppression effect is achieved by placing the guard bands in the L-shape around the target triple-well area on the p-substrate.