Test compression / decompression using variable-length coding is an efficient method for reducing the test application cost, i.e., test application time and the size of the storage of an LSI tester. However, some coding techniques impose slow test application, and consequently a large test application time is required despite the high compression. In this paper, we clarify the fact that test application time depends on the compression ratio and the length of codewords and then propose a new Huffman-based coding method for achieving small test application time in a given test environment. The proposed coding method adjusts both of the compression ratio and the minimum length of the codewords to the test environment. Experimental results show that the proposed method can achieve small test application time while keeping high compression ratio.

Statistical wafer-level characteristic variation modeling offers an attractive method for reducing the measurement cost in large-scale integrated (LSI) circuit testing while maintaining test quality. In this method, the performance of unmeasured LSI circuits fabricated on a wafer is statistically predicted based on a few measured LSI circuits. Conventional statistical methods model spatially smooth variations in the wafers. However, actual wafers can exhibit discontinuous variations that are systematically caused by the manufacturing environment, such as shot dependence. In this paper, we propose a modeling method that considers discontinuous variations in wafer characteristics by applying the knowledge of manufacturing engineers to a model estimated using Gaussian process regression. In the proposed method, the process variation is decomposed into systematic discontinuous and global components to improve estimation accuracy. An evaluation performed using an industrial production test dataset indicates that the proposed method effectively reduces the estimation error for an entire wafer by over 36% compared with conventional methods.

Test compression / decompression is an efficient method for reducing the test application cost. In this letter we propose a response compression method based on Huffman coding. The proposed method guarantees zero-aliasing and it is independent of the fault model and the structure of a circuit-under-test. Experimental results of the compression ratio and the size of the encoder for the proposed method are presented.

Wafer-level performance prediction techniques have been increasingly gaining attention in production LSI testing due to their ability to reduce measurement costs without compromising test quality. Despite the availability of several efficient methods, the site-to-site variation commonly observed in multi-site testing for radio frequency circuits remains inadequately addressed. In this manuscript, we propose a wafer-level performance prediction approach for multi-site testing that takes into account the site-to-site variation. Our proposed method is built on the Gaussian process, a widely utilized wafer-level spatial correlation modeling technique, and enhances prediction accuracy by extending hierarchical modeling to leverage the test site information test engineers provide. Additionally, we propose a test-site sampling method that maximizes cost reduction while maintaining sufficient estimation accuracy. Our experimental results, which employ industrial production test data, demonstrate that our proposed method can decrease the estimation error to 1/19 of that a conventional method achieves. Furthermore, our sampling method can reduce the required measurements by 97% while ensuring satisfactory estimation accuracy.

As technology further scales semiconductor devices, aging-induced device degradation has become one of the major threats to device reliability. In addition, aging mechanisms like the negative bias temperature instability (NBTI) are known to be sensitive to workload (i.e., signal probability) that is hard to be assumed at design phase. In this work, we analyze the workload dependence of NBTI degradation using a processor, and propose a novel technique to estimate the worst-case paths. In our approach, we exploit the fact that the deterministic nature of circuit structure limits the amount of NBTI degradation on different paths, and propose a two-stage path extraction algorithm to identify the invariant critical paths (ICPs) in the processor. Utilizing these paths, we also propose an optimization technique for the replacement of internal node control logic that mitigates the NBTI degradation in the design. Through numerical experiment on two processor designs, we achieved nearly 300x reduction in the sheer number of paths on both designs. Utilizing the extracted ICPs, we achieved 96x-197x speedup without loss in mitigation gain.

We propose a novel technique for the estimation of device-parameters suitable for postfabrication performance compensation and adaptive delay testing, which are effective means to improve the yield and reliability of LSIs. The proposed technique is based on Bayes' theorem, in which the device-parameters of a chip, such as the threshold voltage of transistors, are estimated by current signatures obtained in a regular IDDQ testing framework. Neither additional circuit implementation nor additional measurement is required for the purpose of parameter estimation. Numerical experiments demonstrate that the proposed technique can achieve 10-mV accuracy in threshold voltage estimations.

As technology further scales semiconductor devices, aging-induced device degradation has become one of the major threats to device reliability. Hence, taking aging-induced degradation into account during the design phase can greatly improve the reliability of the manufactured devices. However, accurately estimating the aging effect for extremely large circuits, like processors, is time-consuming. In this research, we focus on the negative bias temperature instability (NBTI) as the aging-induced degradation mechanism, and propose a fast and efficient way of estimating NBTI-induced delay degradation by utilizing static-timing analysis (STA) and simulation-based lookup table (LUT). We modeled each type of gates at different degradation levels, load capacitances and input slews. Using these gate-delay models, path delays of arbitrary circuits can be efficiently estimated. With a typical five-stage pipelined processor as the design target, by comparing the calculated delay from LUT with the reference delay calculated by a commercial circuit simulator, we achieved 4114 times speedup within 5.6% delay error.

We propose a novel IDDQ outlier screening flow through a two-phase approach: a clustering-based filtering and an estimation-based current-threshold determination. In the proposed flow, a clustering technique first filters out chips that have high IDDQ current. Then, in the current-threshold determination phase, device-parameters of the unfiltered chips are estimated based on measured IDDQ currents through Bayesian inference. The estimated device-parameters will further be used to determine a statistical leakage current distribution for each test pattern and to calculate a and suitable current-threshold. Numerical experiments using a virtual wafer show that our proposed technique is 14 times more accurate than the neighbor nearest residual (NNR) method and can achieve 80% of the test escape in the case of small leakage faults whose ratios of leakage fault sizes to the nominal IDDQ current are above 40%.

Replacement of highly stressed logic gates with internal node control (INC) logics is known to be an effective way to alleviate timing degradation due to NBTI. We propose a path clustering approach to accelerate finding effective replacement gates. Upon the observation that there exist paths that always become timing critical after aging, critical path candidates are clustered to select representative path in each cluster. With efficient data structure to further reduce timing calculation, INC logic optimization has first became tractable in practical time. Through the experiments using a processor, 171x speedup has been demonstrated while retaining almost the same level of mitigation gain.

Analyzing aging-induced delay degradations of ring oscillators (ROs) is an effective way to detect recycled field-programmable gate arrays (FPGAs). However, it requires a large number of RO measurements for all FPGAs before shipping, which increases the measurement costs. We propose a cost-efficient recycled FPGA detection method using a statistical performance characterization technique called virtual probe (VP) based on compressed sensing. The VP technique enables the accurate prediction of the spatial process variation of RO frequencies on a die by using a very small number of sample RO measurements. Using the predicted frequency variation as a supervisor, the machine-learning model classifies target FPGAs as either recycled or fresh. Through experiments conducted using 50 commercial FPGAs, we demonstrate that the proposed method achieves 90% cost reduction for RO measurements while preserving the detection accuracy. Furthermore, a one-class support vector machine algorithm was used to classify target FPGAs with around 94% detection accuracy.