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Takayuki SHIBATA Yutaka AOKI Manabu OTSUKA Takaharu IDOGAKI Tadashi HATTORI
The majority of independent locomotion microrobots pack batteries as their energy source. However, because the energy that can be stored in a battery is proportional to its volume, the operating time becomes shorter as the robot becomes smaller. To solve this problem the energy must be supplied from outside by wireless transmission. We propose a microwave energy transmission system for microrobots in metal piping. Because microwave is rectified and converted in the form of electric energy in this system, we developed a receiving antenna for microrobots in piping and a microwave rectifying circuit to generate high voltage. These were loaded on a microrobot, tested to drive a locomotive mechanism, and the efficiency of the proposed system was confirmed.
Takashi KANEKO Yutaka YAMAGATA Takaharu IDOGAKI Tadashi HATTORI Toshiro HIGUCHI
A 3-dimensional specific thickness profile was fabricated on a thin glass diaphragm lens to reduce aberration at short focal distances for greater dynamic focusing. The deformation of the diaphragm was calculated by stress analysis utilizing the Finite Element Method (FEM). Geometric non linearity is considered in the FEM analysis. The glass diaphragm is 10 mm in diameter and the average thickness is 11 µm. To obtain both a curved shape and an optical surface on the glass diaphragm, the 3-dimensional precision grinding technique was utilized. The processed shape matches the designed one with less than 0.3 µm deviation, and the average surface roughness is 0.005 µm. Optical characteristics of the dynamic focusing lens having a specific thickness profile, were measured by Modulation Transfer Function (MTF) measurement equipment. At a focal distance of 250 mm, the specific thickness diaphragm lens resolution is 10 cycles/mm, whereas, the uniform thickness diaphragm is 4 cycles/mm. Even at other focal distances, the specific thickness diaphragm shows superior optical characteristics in comparison with those of the uniform thickness diaphragm. The 3-dimensional profile diaphragm resolution is 2.5 times finer at a focal distance of 250 mm, thus, being capable of displacement control for variable optic devices. This was achieved by employing semiconductor processing methods in conjunction with precision grinding techniques which are necessary for fabricating micro structures.