We demonstrated the reduced surface roughness of poly (3-hexylthiophene) (P3HT):(6,6)-phenyl-C61-butyric acid methyl ester (PCBM) thin films with different ratios fabricated by the electrospray deposition (ESD) method. Aggregated structures were observed at the lower voltage, and the uniformity became bad at the higher voltage. Anyway, the minimum root mean square (RMS) roughness was 1.46 nm by optimizing the applied voltage.

A 3-dimensional specific thickness profile was fabricated on a thin glass diaphragm lens to reduce aberration at short focal distances for greater dynamic focusing. The deformation of the diaphragm was calculated by stress analysis utilizing the Finite Element Method (FEM). Geometric non linearity is considered in the FEM analysis. The glass diaphragm is 10 mm in diameter and the average thickness is 11 µm. To obtain both a curved shape and an optical surface on the glass diaphragm, the 3-dimensional precision grinding technique was utilized. The processed shape matches the designed one with less than 0.3 µm deviation, and the average surface roughness is 0.005 µm. Optical characteristics of the dynamic focusing lens having a specific thickness profile, were measured by Modulation Transfer Function (MTF) measurement equipment. At a focal distance of 250 mm, the specific thickness diaphragm lens resolution is 10 cycles/mm, whereas, the uniform thickness diaphragm is 4 cycles/mm. Even at other focal distances, the specific thickness diaphragm shows superior optical characteristics in comparison with those of the uniform thickness diaphragm. The 3-dimensional profile diaphragm resolution is 2.5 times finer at a focal distance of 250 mm, thus, being capable of displacement control for variable optic devices. This was achieved by employing semiconductor processing methods in conjunction with precision grinding techniques which are necessary for fabricating micro structures.