The major task in compact modeling for high power devices is to predict the switching waveform accurately because it determines the energy loss of circuits. Device capacitance mainly determines the switching characteristics, which makes accurate capacitance modeling inevitable. This paper presents a newly developed compact model HiSIM-GaN [Hiroshima University STARC IGFET Model for Gallium-Nitride-based High Electron Mobility Transistors (GaN-HEMTs)], where the focus is given on the accurate modeling of the field-plate (FP), which is introduced to delocalize the electric-field peak that occurs at the electrode edge. We demonstrate that the proposed model reproduces capacitance measurements of a GaN-HEMT accurately without fitting parameters. Furthermore, the influence of the field plate on the studied circuit performance is analyzed.

We have developed a model for circuit-simulation which describes the MOSFET region from pinch-off to drain contact based on the surface potential. The model relates the surface-potential increase beyond the pinch-off point to the channel/drain junction profile by applying the Gauss law with the assumption that the lateral field is greater than the vertical one. Explicit equations for the lateral field and the pinch-off length are obtained, which take the potential increase in the drain overlap region into account. The model, as implemented into a circuit simulator, correctly reproduces measured channel conductance and overlap capacitance for 100 nm pocket-implant technologies as a function of bias condition and gate length.