This paper demonstrates a FinFET operational amplifier (opamp), which is suitable to be integrated with digital circuits in a scaled low-standby-power (LSTP) technology and operates at extremely low voltage. The opamp is consisting of an adaptive threshold-voltage (Vt) differential pair and a low-voltage source follower using independent-double-gate- (IDG-) FinFETs. These two components enable the opamp to extend the common-mode voltage range (CMR) below the nominal Vt even if the supply voltage is less than 1.0 V. The opamp was implemented by our FinFET technology co-integrating common-DG- (CDG-) and IDG-FinFETs. More than 40-dB DC gain and 1-MHz gain-bandwidth product in the 500-mV-wide input CMR at the supply voltage of 0.7 V was estimated with SPICE simulation. The fabricated chip successfully demonstrated the 0.7-V operation with the 480-mV-wide CMR, even though the nominal Vt was 400 mV.

The Flex Power FPGA is presented as a novel FPGA model offering the ability to configure the trade-off between power consumption and speed for each logic element by adjusting the threshold voltage. This FPGA model targets the reduction of static power consumption, which has become one of the most important issues in the development of future-generation devices. The present paper describes a preliminary simulation study of the Flex Power FPGA. A method to effectively assign threshold voltages to transistors at a prescribed granularity based on a timing analysis of the mapped circuit is implemented using the VPR simulator, and the static power reduction for 70 nm technologies is estimated using MCNC benchmark circuits. Simulation results show that the average static power can be reduced to as little as 1/30 of that in the corresponding conventional FPGA. This FPGA model is also demonstrated to be effective with future technologies, where the proportion of static power will be greater.

Aiming at drastically reducing standby leakage current, an SRAM using Four-Terminal- (4T-) FinFETs, named Flex-Vth SRAM, with a dynamic row-by-row threshold voltage control (RRTC) was developed. The Flex-Vth SRAM realizes an extremely low standby-leakage current thanks to the flexible threshold-voltage (Vth) controllability of the 4T-FinFETs, while its access speed and static noise margin (SNM) are maintained. A TCAD-based Monte Carlo simulation indicates that even when the process-induced random variation in the device performance is taken into account, the Flex-Vth SRAM reduces the leakage current to 1/100 of that of a standard SRAM in a 256256 array, where 20-nm-gate-length technologies with the same on-current are assumed.

This paper describes a new design concept, the Body Bias Voltage Set (BBVS), and presents the effect of the BBVS on static power, operating speed, and area overhead in an FPGA with field-programmable Vth components. A Flex Power FPGA is an FPGA architecture to solve the static power problem by the fine grain field-programmable Vth control method. Since the Vth of transistors for specific circuit blocks in the Flex Power FPGA is chosen from a set of Vth values defined by a BBVS, selection of a particular BBVS is an important design decision. A particular BBVS is chosen by selecting body biases from among several supplied body bias candidates. To select the optimal BBVS, we provide 136 BBVSs and perform a thorough search. In a BBVS of less Vth steps, the deepest reverse body bias for high-Vth transistors does not necessarily result in optimal conditions. A BBVS of 0.0 V and -0.8 V, which requires 1.65 times the original area, utilizes as little as 1/30 of the static power of a conventional FPGA without performance degradation. Use of an aggressive forward body bias voltage such as +0.6 V for lowest-Vth, performance is increased by up to 10%. Another BBVS of +0.6 V, 0.0 V, and -0.8 V reduces static power to 14.06% while maintaining a 10% performance increase, but it requires 2.75-fold area.

This paper presents a precise characterization of high-frequency characteristics of intrinsic channel of FinFET. For the de-embedding of the parasitics attached to the source, drain and gate terminals, it proposes special calibration patterns which can place the reference surface just beside the intrinsic part of the FinFET. It compares the measured S parameter data up to 40 GHz with the device simulation and shows good matching. The experimental data of the through pattern also confirms the accuracy of the de-embedded parasitics and extracted intrinsic part of FinFET.