Device modeling techniques for high-frequency circuits operating at over 100 GHz are presented. We have proposed the bond-based design as an accurate high-frequency circuit design method. Because layout parasitic extractions (LPE) are not required in the bond-based design, it can be applied high-frequency circuit design at over 100 GHz. However, customized device models are indispensable for the bond-based design. In this paper, device modeling techniques for high-frequency circuit design using the bond-based design are proposed. The customized device model for MOSFETs, transmission lines and pads are introduced. By using customized device models, the difference between the simulated and measured gains of an amplifier is improved to less than 0.6 dB at 120 GHz.

The design and measured results of a 120-GHz transmitter and receiver chipset are described in this paper. A simple on-off keying (OOK) modulation is adopted for low power consumption. The proposed transmitter and receiver are fabricated using 65-nm CMOS technology. The current consumption of the transmitter and receiver are 19.2 mA and 48.2 mA respectively. A 9-Gbps PRBS is successfully transferred from the transmitter to the receiver with the bit error rate less than 10-9.