In this report, Focused Ion Beam (FIB) -- SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5 µm.

In recent years, there has been increasing demand to miniaturize wiring harness connectors in automobiles due to the increasing volume of electronic equipment and the reduction of the installation space allocated for the electronic equipment in automobiles for the comfort of the passengers. With this demand, contact failure caused by the fretting corrosion is expected to become a serious problem. In this report, we examined micro-structural observations of fretting contacts of two different tin plating thicknesses using Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) and so on. Based on the results, we compared the microstructure difference of fretting contact caused by the difference of the tin plating thickness.

In recent years, there has been increasing demand to miniaturize wiring harness connectors in automobiles due to the increasing volume of electronic equipment and so on. With this demand, contact failure caused by the fretting corrosion seems to become a serious problem in the future. In this report, three-dimensional observations using Focused Ion Beam (FIB)-SEM method have been made for tin plated fretting contacts before and after the contact resistance increase with tin plating thickness 5 µm. With these observations, the three dimensional structural transition from tin to tin oxide have been examined.

Constriction resistance is calculated by numerical analysis using Laplace's equations for electric potential of steady state in many cases of contact spot dispersion-status. The results show that contact resistance does not increase beyond 1.5 times even if the total real contact area is about 15% of the apparent contact area. When real contact area is at least about 60% of the apparent contact area, the contact resistance is approximately the same as the constriction resistance acquired from the apparent contact area. When the real contact area is about 50% of the apparent contact area, the contact resistance is approximately constant without regard to the contact shape and contact-point dispersion layout. Therefore, it is proved that contact resistance can be practically calculated using apparent contact area instead of real contact area when there are many contact points caused by metal to metal contact.

The authors previously conducted the observation of microstructures and three-dimensional SEM on fretting wear phenomena at tin-plated contacts. In this study, we report the fretting characteristics of dissimilar metal contacts by studying the relation between the contact resistance behaviors and micro structural changes of gold and tin-plated fretting contacts, through surface SEM observations and cross sectional SEM and AES analysis.

A press-fit connection is a solderless electrical connection technology, which utilizes the mechanical contact force generated between through-holes on a printed circuit board (PCB) and terminals with a width slightly larger than the through-hole diameter. This technology has been widely noted recently as a measure against the "Lead Free Requirement" of materials comprising electric/electronic devices, especially in the area of automobile connector. For the application of this technology to automobile connectors, we have to take into account the severe requirement, such as (1) the adaptation to wider through-hole diameter tolerance range and (2) the establishment of connection reliability for the various PCB surface treatments. As a result, we have determined the minimum and maximum contact forces satisfying the long term connection reliability and designed the terminal shape, which has been refined the N-shape cross section developed before, by using three dimensional finite element methods (FEM). Furthermore, we have developed a new type of hard tin plating on terminals, thus preventing the scraping-off of tin during the insertion process, that could result in a short-circuit on the PCB, for the Organic Solderability Preservative (OSP) treated PCB. The press-fit connector for the automobile airbag Electronic Control Units (ECUs) we developed has been able to transfer to the mass-production phase successfully from August 2005.

Electrical contacts are the most important parts of electrical circuits, and many reliability problems of the circuits are related to contact failure. The contact resistance is one of the important factors for assessing connector reliability, and thus the prediction of contact resistance is essential to designing electrical terminals. In this study, embossments, each 1 mm to 3 mm in radius, were brought into contact with flat planes to simulate the point of contact on a terminal, and the contact resistance was measured using a four-probe method under a load up to 40 N. Copper alloy samples, each plated with tin or silver and having an embossment of 1 mm to 3 mm in radius, were used and the visually clear indentations resulting from the embossment to plane contact were measured to determine their areas. Since the contact resistance is dependent on the contact area, an FEM analysis must be carried out to determine the contact areas correctly. In this paper, an elasto-plastic FEM analysis was performed taking the plating layers into account, and a method was established to make precise determination of the contact areas for different shapes of contacts and loads. The resultant contact areas were used to calculate the contact resistance, which showed a good agreement with experimental results. It was established that the load-resistance curves can be predicted on the basis of the shapes of the contacts as well as plating.

Tin and its alloys have been applied for the plating of electrical contacts for low electrical power conditions. In particular, tin-plated contacts are widely used as connector contacts in automotive applications and as make-break contacts in keyboard switches. In the relationship between contact resistance (R) and contact load (W) for both solid and plated tin, singularities have been found. Previously established and well known theories on the deformation of contact interfaces cannot explain these singularities. In this study, to clarify these singularities, and to obtain a contact model explaining this phenomenon, contact traces for contact load were examined by SEM and STM. The obtained microscopic images indicated piling-up at the periphery of the contact area for both solid and plated tin. In this case the contact configuration comprised a platinum probe with a hemispherical tip surface and a flat tin surface for both solid and plated. When the probe was loaded, this tip of the probe sank into the soft tin surface owing to its lower hardness. In case of solid tin, the sinking of the probe surface into the tin surface causes piling-up around the periphery of the contact trace. In this deformation process, since the periphery of the indentation of the indented contact area severely slid against the surface of the platinum probe while applying a contact load, the contact resistance rapidly decreased with load. In this case, the center portion of the true contact area was not affected mechanically; thus, the surface film on the bottom portion of the deformed of the flat surface did not break down mechanically. On the other hand, in the case of a tin plated surface, similar piling up occurred; however, it was accompanied by scattering and separation of tin crystal grains from the surface. As a result of this process, a decrease in contact resistance similar to that for the solid tin occurred. Since the piling-up of the contact surface is a very important process in the application of connectors, the above-mentioned unusual characteristics were clarified in this study.

Characteristics of conductive elastomer that is composed of silicone rubber and dispersed carbon black particles show conductive and elastic properties in one simple material. This material has been widely applied to make-break contacts of panel switches and connectors of liquid crystal panels. However, since surface state of the contact is very soft, it is difficult to remove contaminant films of contaminated opposite side contact surface and to obtain low contact resistance owing to break the film. This is an important problem to be solved not only for the application of make-break switching contact but also static connector contacts. This study has been conducted to examine some complex structures of the elastomer which indicate removal characteristics for contaminant films and low contact resistance. As specimens, six different types of elastomer contacts composed of different type of dispersed materials as carbon and metal fibers, metal mesh, and plated surfaces were used. The contacts of opposite side were Au and Sn plated contact surface on a printed circuit board (PCB) which is usually used in the static connector and make-break contacts. In order to contaminate contact surfaces of PCB, the surfaces were subjected to exposure in an SO2 gas environment. The elastomeric contacts contained hard materials showed lower contact resistance than only dispersed carbon particles in the elastomer matrix for both contaminated PCB contact surfaces.

Tin (Sn) contacts are widely applied to connector contacts. Surfaces of plated tin layer are covered with an oxide film that results in high contact resistance. However, it is possible to obtain low contact resistance by using high contact load. Current downsizing trends often make it difficult to obtain high contact loads. Therefore, it is important to conduct basic studies of the contacts resistance characteristics under low contact load conditions. In this study, relationships between contact resistance and the changes of contact traces were examined. When a platinum (Pt) hemisphere contacted to tin plated flat coupon, it was found that the hemisphere surface sank into the softer tin plated flat surface during loading resulting in a piling up tin crystal grains along the periphery of the contact trace. During this process, sudden decrease in contact resistance was observed. To clarify the phenomenon, morphology changes of contact traces were observed by AFM, SEM and EBSD. FEM analysis was also used to analyze the mechanical stress distribution in the tin plated layer. Due to the peculiar distribution of stress, the crystal grains are separated and push out the contact area. This phenomenon is very different from commonly observed decrease in contact resistance due to elastic and plastic deformation inducing mechanical fracture of the surface oxide film.

In recent years, there have been ever-increasing demands to miniaturize automotive connectors. However, because the contact force decreases as connectors are miniaturized further, fretting corrosion, which is a typical problem occurring with low-force electric contacts, is expected to become a more serious problem in future. This time we developed a new experimental device capable of controlling the contact load, fretting amplitude, fretting frequency, contact part temperature and humidity optionally. In this report, we used the design of experiments method, and quantitatively evaluated the extent of the influence of the expected factor (in terms of load, amplitude, and plating thickness, etc.) on the fretting phenomenon, which occurs in the tin plating of the connector terminal. Moreover, based on SEM examination, we analyzed the surface and cross section of the contact parts when degradation occurs, and considered the mechanism of the degradation.

The reliability of a connector depends on the contact force generated by the spring in the terminal of a connector. The springs are commonly formed by stamping from a strip of spring material. Therefore, the prediction of the force — displacement relation by the finite element (FE) method is very important for the design of terminals. For simulation, an accurate model of stress-strain (s-s) responses of the materials is required. When the materials are deformed in the forward and then the reverse directions, almost all spring materials show different s-s responses between the two directions, due to the Bauschinger effect. This phenomenon makes simulation difficult because the s-s response depends on the prior deformation of the material. Hence, the measurement of the s-s response is the elementary process, by cyclic tension and compression testing in which materials deform elastically and plastically. Then, the s-s responses should be described accurately by mathematical models for FE simulation. In this paper, the authors compare the experimental s-s responses of copper-based materials with conventional mathematical models and the Yoshida-Uemori model, which is a constitutive model having high capability of describing the elastic and plastic behavior of cyclic deformation. The calculated s-s responses only by Yoshida-Uemori model were in very good agreement with the corresponding experimental results. Therefore, the use of this model for FE simulation would be recommended for a more accurate prediction of force-displacement relation of the spring.

Electrical contacts are an important part of electrical circuits and many reliability problems are related to electrical contact failure. It is important to investigate the relationship between load and contact resistance which is an important factor of contact reliability. In this study, the effect of plated material and plated thickness on contact resistance was examined. The samples were constructed of a copper alloy with tin or silver plating. Contact configuration was hemispherical-flat contact. The contact resistance was measured by using a four-probe method with a load up to 40 N. The relation between indentation contact area (i.e. apparent contact area) and contact resistance was determined. As experimental results, the contact resistance depends on the indentation of the contact area. In the same contact area, tin-plated samples have higher resistance than those that are silver-plated due to their own resistivity. The constriction resistance of a plated layer, which depends on contact area, plated material and plated thickness, is analyzed by a theoretical solution, which is shown by R=Φρ /2a, using a surface resistance coefficient Φ . The theoretical results show almost good agreement with the experimental results. Thus, the indentation contact area (i.e. apparent contact area) is almost the same as the real contact area in this study.

Due to the recent increase in electronic devices mounted on automobiles, a large number of connectors, especially low-cost tin plated connectors are being used. As a result, their contact reliability has become problematic. Furthermore, for the connectors which are subjected to fretting wear caused by heat cycle and vibrations, the contact resistance increases because of wear of tin and deposition of oxides, which generates problems of poor contact. This study is intended to analyze the change in contact resistance of tin plated connectors from the start of fretting wear to the end of their lifetime from the viewpoint of practical reliability, and to observe the trace and the characteristics of fretting wear microscopically. This study found that wear and oxidation of tin plated connectors start immediately with fretting wear, and thus accumulation of abrasion powder on fretting areas causes connectors to reach to the end of their useful lifetime quickly. Especially, it was demonstrated that amplitude of fretting has a considerable influence on a connector's lifetime. It is made clear that air-tightness, so-called "gas-tight" of tin in a fretting area influences fretting wear considerably.