This paper describes a 3.5 V operation InGaP HBT MMIC power amplifier module for use in GSM/EDGE dual-mode, 900/1800/1900 MHz triple band handset applications. Conventional GSM amplifiers have a high linear gain of 40 dB or more to realize efficiency operation in large gain compression state exceeding at least 5 dB. On the other hand, an EDGE amplifier needs a linear operation to prevent signal distortion. This means that a high linear gain amplifier cannot be applied to the EDGE amplifier, because the high gain leads to the high noise power in the receive band (Rx-noise). In order to solve this problem, we have changed the linear gain of the amplifier between GSM and EDGE mode. In EDGE mode, the stage number of the amplifier changes from three to two. To reduce a high gain, the first stage transistors in the amplifier is bypassed through the diode switches. This newly proposed bypass circuit enables a high gain in GSM mode and a low gain in EDGE, thus allowing the amplifier to operate with high efficiency in both modes while satisfying the Rx-noise specification. In conclusion, with diode switches and a band select switch built on the MMIC, the module delivers a Pout of 35.5 dBm and a PAE of about 50% for GSM900, a 33.4 dBm Pout and a 45% PAE for GSM1800/1900. While satisfying an error vector magnitude (EVM) of less than 4% and a receive-band noise power of less than -85 dBm/100 kHz, the module also delivers a 29.5 dBm Pout and a PAE of over 25% for EDGE900, a 28.5 dBm Pout and a PAE of over 25% for EDGE1800/1900.

A new GaAs negative voltage generator suitable for biasing a GaAs MESFET power amplifier has been successfully developed and applied to a 1.9-GHz single-chip transmit/receive (T/R)-MMIC front-end including a power amplifier, a T/R-switch, and so on. To meet various requirements necessary for integration with a power amplifier, four new circuit techniques are introduced into this generator: (1)complementary charge pump operation to suppress spurious outputs. (2)an SCFL-to-DCFL cross-coupled level shifter to ensure a wide operation voltage range, (3)a level control circuit to reduce output voltage deviation caused by output current, and (4)interface and layout designs to achieve sufficient isolation between the power amplifier and the generator. The generator was incorporated into the MMIC front-end, and it was tested with a 30-lead shrink small outline package. With 20-to-500-MHz external input signals of more than -15 dBm, the generator produces negative voltages from -1.0 to -2.6 V for a wide range of suppiy voltages from 1.6 to 4.5 V. The current consumption is as low as 3.2 mA at 3 V. When a 22-dBm output is delivered through the power amplifier biased by the generator, low spurious outputs below -70 dBc are achieved. and gate-bias voltage deviations are suppressed to within 0.06 V even when a gate current of -140 µA flows through the amplifier. The generator also enables high speed operation of charge time below 200 ns, which is effective in TDMA systems such as digital cordless telephone systems. In layout design, electromagnetic simulation was utilized for estimating sufficient isolation between circuits in the MMIC. This negative voltage generator and its application techniques will enable GaAs high-density integration devices as well as single voltage operation of a GaAs MESFET power amplifier.

A single-chip GaAs Transmit/Receive (T/R)-MMIC front-end has been developed which is applicable to 1. 9-GHz personal communication terminals such as digital cordless phones. This chip is fabricated using a planar self-aligned gate FET useful for low-cost and high-volume production. The chip integrates RF front-end analog circuits a power amplifier, a T/R-switch, and a low-noise amplifier. Additionally integrated are a newly developed voltage-doubler negative-voltage generator (VDNVG) and a control logic circuit to control transmit and receive functions, enabling both a single-voltage operation and an enhanced power handling capability of the switch, even under a single low-voltage supply condition of 2 V. The power amplifier incorporated onto the chip is capable of delivering a 21 dBm output power at a 39% efficiency, and a 30 dB associated gain with a 2 V single power supply in the transmit mode. The gain and efficiency are higher than those of the previously reported amplifier operating with a 2 V single power supply. The VDNVG produces a step-up voltage of 2. 9 V as well as a negative voltage of -1. 8 V from a 2 V power supply, operating with a charge time of less than 0. 25 µs. The control logic circuit on the chip has a newly designed interface circuit utilizing the step-up voltage and negative voltage, thereby enabling the chip to handle high power outputs over 24 dBm with a low operating voltage of 2 V. In the receive mode, a 1. 7 dB noise figure and a 0. 6 dB insertion loss are achieved with a current dissipation of 3. 6 mA. The developed MMIC, which is the first reported 2 V single-voltage operation T/R-MMIC front-end, is expected to contribute to the size and weight reductions in personal communication terminals.