Ethernet has become an indispensable technology for communications, and has come into use for many applications. At the IEEE, high-speed standardization has been discussed and has seen the adoption of new technologies such as multi-level modulation formats, high baud rate modulation and dense wave length division multiplexing. The MSA transceiver form factor has also been discussed following IEEE standardization. Optical devices such as TOSA and ROSA have been required to become more compact and higher-speed, because each transceiver form factor has to be miniaturized for high-density construction. We introduce the technologies for realizing 100GbE and those applicable to 400GbE. We also discuss future packages for optical devices. There are many similarities between optical device packages and electrical device packages, and we predict that optical device packages will follow the trends seen in electrical devices. But there are also differences between optical and electrical devices. It is necessary to utilize new technology for specific optical issues to employ advanced electrical packaging and catch up the trends.

This paper presents a new simple method for reducing mutual coupling between dual-element microstrip antennas (MSAs) for bistatic radar using a wave absorber. The two elements are closely placed on a substrate by the distance of λ0/4 through the wall-shaped absorber. The height and width of the absorber were optimized for minimum mutual coupling with the electromagnetic simulator. It was found that less than -60 dB minimum mutual coupling can be achieved by the impedance matching of the absorber in a near field. The influence for the reflection characteristics from the absorber is small enough, and the reduction of the antenna gain is only 1.1 dB. The rate of the lost power characteristics showed that the absorption improves the mutual couplings. Then the proposed structure for a practical configuration was investigated. The measurement results of the optimized structure tallied well with the simulation results.

This letter proposes a new algorithm for the check node update in the decoding of low-density parity-check (LDPC) codes. The proposed algorithm is based on a new approximation formula of standard sum-product algorithm (SPA) which can reduce the approximation error of min-sum algorithm (MSA) and has almost the same performance as sum-product algorithm (SPA) under both floating precision operation and fixed-point operation. Besides, the new approximation formula can be implemented in simple structures competitive with MSA.

This letter presents mutual coupling reduction in an E-plane arranged microstrip patch array fed by a triplate waveguide. Five mushroom-like electromagnetic band-gap (EBG) elements arranged in one column are embedded both between two radiating patches and between the feeding lines for suppression of the surface wave and the parallel plate mode, respectively. Validity of the proposed EBG elements is confirmed by the measurement.

In this paper, mutual coupling S21 between RMSA (ring-shaped microstrip antenna) elements was estimated by the EMF method based on the cavity model. Then, the validity of the proposed method was tested by experiments. The experiments confirmed satisfactory agreement between the computed and experimental data for S21 in both E- and H-plane arrangements. In addition, a circularly polarized planar array composed of R-MSA elements was designed on the basis of the data of S21. The experimental results of such a planar array demonstrated high performance in radiation pattern as well as axial ratio property. Furthermore, the active reflection coefficient Γ in the R-MSA array was also investigated in both equilateral and square arrangements. The computed results of active reflection coefficient in the array demonstrated high performance in both arrangements.