Interconnect Length Distribution (ILD) represents the correlation between the number of interconnects and their length. The ILD can predict power consumption, clock frequency, chip size, etc. High core utilization and small circuit area have been reported to improve chip performance. We propose an ILD model to predict the correlation between core utilization and chip performance. The proposed model predicts the influences of interconnect length and interconnect density on circuit performances. As core utilization increases, small and simple circuits improve the performances. In large complex circuits, decreasing the wire coupling capacitance is more important than decreasing the total interconnect length for improvement of chip performance. The proposed ILD model expresses the actual ILD more accurately than conventional models.

This paper concerns a new model for estimating the wire length distribution (WLD) of a system-on-a-chip (SoC). The WLD represents the correlation between wire length and the number of interconnects, and we can predict circuit performances such as power consumption, maximum clock frequency, and chip size from the WLD. A WLD model considering core utilization has been proposed, and the core utilization has a large impact on circuit performance. However, the WLD model can treat only a one-function circuit. We propose a new WLD model considering core utilization to estimate the wire length distribution of SoC, which consists of several different-function macroblocks. We present an optimization method to determine each core utilization of macroblocks.