Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.
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Yasushi ITOH, Kazuhiko HONJO, "77-GHz MMIC Module Design Techniques for Automotive Radar Applications" in IEICE TRANSACTIONS on Electronics,
vol. E88-C, no. 10, pp. 1939-1946, October 2005, doi: 10.1093/ietele/e88-c.10.1939.
Abstract: Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.
URL: https://globals.ieice.org/en_transactions/electronics/10.1093/ietele/e88-c.10.1939/_p
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@ARTICLE{e88-c_10_1939,
author={Yasushi ITOH, Kazuhiko HONJO, },
journal={IEICE TRANSACTIONS on Electronics},
title={77-GHz MMIC Module Design Techniques for Automotive Radar Applications},
year={2005},
volume={E88-C},
number={10},
pages={1939-1946},
abstract={Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.},
keywords={},
doi={10.1093/ietele/e88-c.10.1939},
ISSN={},
month={October},}
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TY - JOUR
TI - 77-GHz MMIC Module Design Techniques for Automotive Radar Applications
T2 - IEICE TRANSACTIONS on Electronics
SP - 1939
EP - 1946
AU - Yasushi ITOH
AU - Kazuhiko HONJO
PY - 2005
DO - 10.1093/ietele/e88-c.10.1939
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E88-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 2005
AB - Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.
ER -