Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment

Takashi HARADA; Norio MASUDA; Masahiro YAMAGUCHI

doi:10.1093/ietele/e89-c.1.9

Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment

Takashi HARADA, Norio MASUDA, Masahiro YAMAGUCHI

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Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.

Publication: IEICE TRANSACTIONS on Electronics Vol.E89-C No.1 pp.9-15

Publication Date: 2006/01/01

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Online ISSN: 1745-1353

DOI: 10.1093/ietele/e89-c.1.9

Type of Manuscript: Special Section INVITED PAPER (Special Section on Near-Field and Far-Field Electromagnetic Absorption and Shielding and Related Technologies)

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Takashi HARADA, Norio MASUDA, Masahiro YAMAGUCHI, "Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment" in IEICE TRANSACTIONS on Electronics, vol. E89-C, no. 1, pp. 9-15, January 2006, doi: 10.1093/ietele/e89-c.1.9.
Abstract: Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.
URL: https://globals.ieice.org/en_transactions/electronics/10.1093/ietele/e89-c.1.9/_p

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@ARTICLE{e89-c_1_9,
author={Takashi HARADA, Norio MASUDA, Masahiro YAMAGUCHI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment},
year={2006},
volume={E89-C},
number={1},
pages={9-15},
abstract={Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.},
keywords={},
doi={10.1093/ietele/e89-c.1.9},
ISSN={1745-1353},
month={January},}

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TY - JOUR
TI - Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment
T2 - IEICE TRANSACTIONS on Electronics
SP - 9
EP - 15
AU - Takashi HARADA
AU - Norio MASUDA
AU - Masahiro YAMAGUCHI
PY - 2006
DO - 10.1093/ietele/e89-c.1.9
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E89-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2006
AB - Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.
ER -