This paper introduces a formation method for 3-dimensional 6 ch.×6 ch. shuffling structures with graded-index (GI) circular core in a multimode polymer optical waveguide for optical printed circuit boards (OPCBs) using a unique photomask-free fabrication technique named the Mosquito method. The interchannel pitch of the fabricated waveguides is 250µm, where all the channels consist of both horizontal and vertical bending structures and the last 6 channels in parallel cross over the first 6 channels. We also report 3-dimensional S-shaped polymer waveguides. In the S-shaped waveguides, the first and last 6 channels with both horizontal and vertical core bending composing the above 3-dimensional shuffling waveguide are separated, in order to evaluate the effect of over-crossing on the loss. It is experimentally confirmed that there is no excess insertion loss due to the shuffling structure in the 3-D shuffling waveguide. The evaluated crosstalk of the 3-D shuffling waveguide is lower than -30dB. The 3-D shuffling waveguide proposed in this paper will be a promising component to achieve high bandwidth density wiring for on-board optical interconnects.

This paper presents a printed circuit board (PCB) integrated multi-layered strip line tandem coupler, which used simple compensating ground through-hole (GTH) elements. The GTH elements on one end of the coupled line can generate additional capacitance between the signal line and the ground, which effectively compensates for the parasitic capacitance around the crossed signal lines on the opposite end of the coupled line. It has been experimentally demonstrated that the proposed coupler fabricated for the X-band is effective to improve both the reflection and the isolation characteristics.

In recent Printed Circuit Boards (PCB), the design size and density have increased, and the improvement of routing tools for PCB is required. There are several routing tools which generate high quality routing patterns when connection requirement can be realized by horizontal and vertical segments only. However, in high density PCB, the connection requirements cannot be realized when only horizontal and vertical segments are used. Up to one third nets can not be realized if no non-orthogonal segments are used. In this paper, a routing method for a single-layer routing area that handles higher density designs in which 45-degree segments are used locally to relax the routing density is introduced. In the proposed method, critical zones in which non-orthogonal segments are required in order to realize the connection requirements are extracted, and 45-degree segments are used only in these zones. By extracting minimal critical zones, the other area that can be used to improve the quality of routing pattern without worry about connectivity issues is maximized. Our proposed method can utilize the routing methods which generate high quality routing pattern even if they only handle horizontal and vertical segments as subroutines. Experiments show that the proposed method analyzes a routing problem properly, and that the routing is realized by using 45-degree segments effectively.

This paper provides an investigation of power distribution network (PDN) performance by a full-wave prediction tool and by experimental measurements. A set of six real boards characterized by increasing complexity is considered in order to establish a solid base for behaviour understanding of printed circuit boards. How the growing complexity impacts on the board performance is investigated by measurements and by simulations. Strengths and weakness of PDN modeling by the full-wave software tool Microwave Studio are highlighted and discussed.

A novel approach is proposed for miniaturizing the unit cell size of electromagnetic bandgap (EBG) structures that suppress power plane noise. In this approach, open stubs are introduced into the shunt circuits of these EBG structures. Since the stub length determines the resonant frequencies of the shunt circuit, the proposed structures can maintain the bandgaps at lower frequencies without increasing the unit cell size. The bandgap frequencies were estimated by dispersion analysis based on the Bloch theorem and full-wave simulations. Sample boards of the proposed EBG structures were fabricated with a unit cell size of 2.1 mm. Highly suppressed noise propagation over the estimated frequency range of 1.9-3.6 GHz including the 2.4-GHz wireless-LAN band was experimentally demonstrated.

We propose a novel technique of matching at both ends of the guard trace to suppress resonance. This approach is derived from the viewpoint that the guard trace acts as a transmission line. We examined that matched termination suppresses guard-trace resonance through simulating a circuit and measuring radiation. We found from these results that the proposed method enables guard-trace voltages to remain low and hence avoids increases in radiation. In addition, we demonstrated that "matched termination at the far end of the guard trace" could suppress guard-trace resonance sufficiently at all frequencies. We eventually found that at least two vias at both ends of the guard trace and only one matching resistor at the far end could suppress guard-trace resonance. With respect to fewer vias, the method we propose has the advantage of reducing restrictions in the printed circuit board layout at the design stage.

Printed circuit boards (PCBs) driven by a connected feed cable are considered to be one of the main sources of the electromagnetic interference (EMI) from electronic devices. In this paper, a method for predicting the electromagnetic (EM) radiation from a PCB driven by a connected feed cable at up to gigahertz frequencies is proposed and demonstrated. The predictive model is based on the transmission line theory and current- and voltage-driven CM generation mechanisms with consideration of antenna impedance. Frequency responses of differential-mode (DM) and common-mode (CM) currents and far-electric field were investigated experimentally and with finite-difference time-domain (FDTD) modeling. First, the dominant component in total EM radiation from the PCB was identified by using the Source-Path-Antenna model. Although CM can dominate the total radiation at lower frequencies, DM is the dominant component above 3 GHz. Second, the method for predicting CM component at lower frequencies is proposed. And its validity was discussed by comparing FDTD calculated and measured results. Specifically, the relationship between the CM current and the terminating resistor was focused as important consequence for the prediction. Good agreement between the measured and predicted results shows the validity of the predicted results. The proposed model can predict CM current with sufficient accuracy, and also identify the primary coupling-mechanism of CM generation. Then far-electric field was predicted by using the proposed method, and it was demonstrated that outline of the frequency response of the undesired EM radiation from the PCB driven by the connected feed cable can be predicted with engineering accuracy (within 6 dB) up to 18 GHz. Finally, as example of application of equivalent circuit model to EMC design, effect of the width of the ground plane was predicted and discussed. The equivalent circuit model provides enough flexibility for different geometrical parameters and increases our ability to provide insights and design guidelines.

A guard trace placed near a signal line reduces common-mode radiation from a printed circuit board. The reduction effect is evaluated by the imbalance difference model, which was proposed by the authors, when the guard trace has exactly the same potential as the return plane. However, depending on interval of ground connection of the guard trace, the radiation can increase when the guard trace resonates. In this paper, the authors show that the increase of radiation is caused by the common mode, and extend the imbalance difference model to explain a mechanism of increase of common-mode radiation. Additionally, the effective via location of the guard trace is proposed to reduce the number of vias. The guard trace voltage due to the resonance excites the common mode at the interface where the cross-sectional structure of the transmission line changes since the common-mode excitation is expressed by the product of the voltage and the difference of current division factors. To suppress the common-mode excitation, the guard trace should be grounded at the point where the cross-sectional structure changes. As a result, the common-mode radiation decreases even when the guard trace resonates.

Power supply noise waveforms are acquired in a voltage domain by an on-chip monitor at resolutions of 0.3 ns/1.2 mV, in a digital test circuit consisting of 0.18-µm CMOS standard logic cells. Concurrently, magnetic field variation on a printed circuit board (PCB) due to power supply current of the test circuit is measured by an off-chip magnetic probing technique. An equivalent circuit model that unifies on- and off-chip impedance network of the entire test setup for EMI analysis is used for calculating the on-chip voltage-mode power supply noise from the off-chip magnetic field measurements. We have confirmed excellent consistency in frequency components of power supply noises up to 300 MHz among those derived by the on-chip direct sensing and the off-chip magnetic probing techniques. These results not only validate the state-of-the art EMI analysis methodology but also promise its connectivity with on-chip power supply integrity analysis at the integrated circuit level, for the first time in both technical fields.

To provide basic considerations for the realization of methods for predicting the electromagnetic (EM) radiation from a printed circuit board (PCB) with plural signal traces driven in the even-mode, the characteristics of the EM radiation resulting from two signal traces on a PCB are investigated experimentally and by numerical modeling. First, the frequency responses of common-mode (CM) current and far-electric field as electromagnetic interference (EMI) are discussed. As the two traces are moved closer to the PCB edge, CM current and far-electric field increase. The frequency responses in the two signal trace case can be identified using insights gained from the single trace case. Second, to understand the details of the increase in CM current, the distribution of the current density on the ground plane is calculated and discussed. Although crosstalk ensues, the rule for PCB design is to keep two high-speed traces on the interior of the PCB whenever possible, from the point of view of EM radiation. Finally, an empirical formula to quantify the relationship between the positions of two traces and CM current is provided and discussed by comparing four different models. Results calculated with the empirical formula and finite-difference time-domain (FDTD) modeling are in good agreement, which indicates the empirical formula may be useful for developing EMI design guidelines.

Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.

For emission from a printed circuit board (PCB) by the common-mode current, the suppression method based on the image theory by placing a conducting plate under the PCB is presented. In order to evaluate the suppression effect by this method the radiation power from the PCB is calculated by using FDTD method. The numerical results show that placing the conducting plate suppresses the emission by the common-mode current. Especially, using the conducting plate bent the sides, it is possible to suppress the emission by the small conducting plate. Further, the experimental results of a radiation power and a maximum electric field intensity show the validity of the numerical results.

Pattern extraction is an indispensable step in bare printed circuit board (PCB) inspection and plays an important role in automatic inspection system design. A good approach for pattern definition and extraction will make the following PCB diagnosis easy and efficient. The window-based technique has great potential in PCB patterns extraction due to its simplicity. The conventional window-based pattern extraction methods, such as Small Seeds Window Extraction method (SSWE) and Large Seeds Window Extraction method (LSWE), have the problems of losing some useful copper traces and splitting slanted-lines into too many small similar windows. These methods introduce the difficulty and computation intensive in automatic inspection. In this paper, a novel method called Contour Based Window Extraction (CBWE) algorithm is proposed for improvement. In comparison with both SSWE and LSWE methods, the CBWE algorithm has several advantages in application. Firstly, all traces can be segmented and enclosed by a valid window. Secondly, the type of the entire horizontal or vertical line of copper trace is preserved. Thirdly, the number of the valid windows is less than that extracted by SSWE and LSWE. From the experimental results, the proposed CBWE algorithm is demonstrated to be very effective in basic pattern extraction from bare PCB image analysis.

Common-mode excitation caused by an imperfect ground plane on a printed circuit board (PCB) has been conventionally explained with the 'current driven' scheme, in which the common-mode current is driven by the ground voltage across the unintentional inductance of the ground plane. We have developed an alternative method for estimating common-mode excitation that is driven by the difference of the common-mode voltages for two connected transmission lines. A parameter called current division factor (CDF) that represents the degree of imbalance of a transmission line explains the common-mode voltage. In this paper, we calculate the CDF with two-dimensional (2-D) static electric field analysis by using the boundary element method (BEM) for asymmetric transmission lines with an arbitrary cross-section. The proposed 2-D method requires less time than three-dimensional simulations. The EMI increase due to a signal line being close to the edge of the ground pattern was evaluated through CDF calculation. The estimated increase agreed well--within 2 dB--with the measured one.

The current paper presents the design, analysis, and implementation of a low-profile resonant dc-to-dc converter that utilizes a coreless printed circuit board transformer as a substitute for the conventional magnetic core-based transformer. A prototype series resonant converter, fabricated in a 40 mm80 mm area with a 4 mm thickness while achieving the maximum efficiency of 85% at a 58 W output power, is used as an example to address the theoretical and practical issues involved in the design, analysis, and implementation of a PCB transformer-based low-profile dc-to-dc converter.

The effect of the structure with difference on cross-section for the enlarged models that simulates signal transmission line (STL) in the magnetic head of HDD is discussed. The experimental results suggested that strip and shield structure are effective for suppression of EMI.

In this paper, as a practical application, we focus on the genetic algorithm (GA) for multi-head surface mounting machines which are used to populate printed circuit boards (PCBs). Although there have been numerous studies on the surface mounting machine, studies on the multi-head case are rare because of its complexity. The multi-head surface mounting machine can pick multiple components simultaneously in one pickup operation and this operation can reduce much portion of the assembly time. Hence we try to minimize the assembly time by maximizing the number of simultaneous pickups, resulting in reduction of PCB production cost. This research introduces a partial-link GA method for the single-head case. Then, we apply this method to the multi-head case by regarding a reel-group as one reel and a component-cluster as one component. The results of computer simulation show that our genetic algorithm is greatly superior to the heuristic algorithm that is currently used in industry.

The visual inspection of printed circuit boards (PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate (0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.

This paper describes the mechanisms of power-distribution-plane resonance in multilayer printed circuit boards and the techniques to control the resonance. The power-distribution-plane resonance is responsible for high-level emissions and circuit malfunctions. Controlling the resonance is an effective technique, so adequate characterization of the resonance is necessary to achieve control. The resonance characteristics of four-layer printed circuit boards are investigated experimentally and theoretically by treating the power-distribution planes as a parallel-plate transmission line with decoupling circuits. Analysis of the forward traveling wave shows that the resonance frequency is determined by the phase delay due to wave propagation and by the phase progress of interconnect inductance in the decoupling circuit. Techniques to control the resonance characteristics are investigated. The resonance can be shifted to a higher frequency by adding several decoupling circuits adjacent to the existing decoupling capacitor or by increasing the number of via holes connecting the capacitor mounting pads to the power-distribution planes.

In this paper, the evaluation of emission from a PCB by using crosstalk between a low frequency signal trace and a digital signal trace is investigated. These signal traces are closely routed in parallel to each other on the different several signal planes in the PCB. It is shown experimentally that the coupled signal trace with a cable section causes drastic increase of emission from the PCB. From the measurement results of current distribution on the cable section, it is shown that this current distribution contributes to the increase of emission from the PCB. Therefore, emission increasing by coupling between signal traces is evaluated by crosstalk between them. The measurement results of radiation and the calculation results of crosstalk on the PCB (deviation from results of the PCB which is referred, respectively) agree with each other within 2 dB range or 3.5 dB range. This result shows that reduction effect of emission from the PCB can be predicted by calculation results of crosstalk. Moreover, it is shown that evaluation of emission level by using crosstalk is useful to decide PCB's structure for reduction of emission from a high-density assembled PCB. From the viewpoint of practical application, it is effective for the reduction of emission from a PCB to separate a low frequency signal trace from a high-speed digital signal trace by ground plane of a PCB.