Effect of the Thermal Constant on Temperature Rise of Silver Palladium Alloy Contacts

Kazuaki MIYANAGA; Yoshiki KAYANO; Hiroshi INOUE

doi:10.1093/ietele/e90-c.7.1405

Effect of the Thermal Constant on Temperature Rise of Silver Palladium Alloy Contacts

Kazuaki MIYANAGA, Yoshiki KAYANO, Hiroshi INOUE

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In this paper, a method of separating the effects of the thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of AgPd contacts was proposed. First, the effects of the Pd content on the durations and integral powers of the bridge and arc, and the temperature rise of the contacts were discussed. Because the integral power of bridge was larger than that of the arc under our experimental conditions of 40 V open-circuit, 5 A close-circuit and 100 µm/s opening velocity, the temperature rise of the contacts was dominated by the bridge. No remarked difference in bridge duration can be seen among the six materials. Although the integral power of the bridge in the case of Pd was maximum, the maximum temperature rise of the contact was observed in the case of AgPd₆₀. To clarify the contribution of each factor, the effect of thermal diffusivity on the temperature rise of the contact was evaluated by the finite-difference time-domain (FDTD) method. In the case of Pd, because its thermal diffusivity was largest, heat diffused rapidly. On the other hand, the thermal diffusivity in the case of AgPd₆₀ was small, and heat diffused slowly to the holders. The maximum temperature rise was observed in the case of AgPd₆₀. It was demonstrated that the proposed method of separating the effects of thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of contacts is effective in enabling us to understand contact phenomena.

Publication: IEICE TRANSACTIONS on Electronics Vol.E90-C No.7 pp.1405-1411

Publication Date: 2007/07/01

Publicized

Online ISSN: 1745-1353

DOI: 10.1093/ietele/e90-c.7.1405

Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))

Category: Contact Phenomena

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Kazuaki MIYANAGA, Yoshiki KAYANO, Hiroshi INOUE, "Effect of the Thermal Constant on Temperature Rise of Silver Palladium Alloy Contacts" in IEICE TRANSACTIONS on Electronics, vol. E90-C, no. 7, pp. 1405-1411, July 2007, doi: 10.1093/ietele/e90-c.7.1405.
Abstract: In this paper, a method of separating the effects of the thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of AgPd contacts was proposed. First, the effects of the Pd content on the durations and integral powers of the bridge and arc, and the temperature rise of the contacts were discussed. Because the integral power of bridge was larger than that of the arc under our experimental conditions of 40 V open-circuit, 5 A close-circuit and 100 µm/s opening velocity, the temperature rise of the contacts was dominated by the bridge. No remarked difference in bridge duration can be seen among the six materials. Although the integral power of the bridge in the case of Pd was maximum, the maximum temperature rise of the contact was observed in the case of AgPd₆₀. To clarify the contribution of each factor, the effect of thermal diffusivity on the temperature rise of the contact was evaluated by the finite-difference time-domain (FDTD) method. In the case of Pd, because its thermal diffusivity was largest, heat diffused rapidly. On the other hand, the thermal diffusivity in the case of AgPd₆₀ was small, and heat diffused slowly to the holders. The maximum temperature rise was observed in the case of AgPd₆₀. It was demonstrated that the proposed method of separating the effects of thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of contacts is effective in enabling us to understand contact phenomena.
URL: https://globals.ieice.org/en_transactions/electronics/10.1093/ietele/e90-c.7.1405/_p

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@ARTICLE{e90-c_7_1405,
author={Kazuaki MIYANAGA, Yoshiki KAYANO, Hiroshi INOUE, },
journal={IEICE TRANSACTIONS on Electronics},
title={Effect of the Thermal Constant on Temperature Rise of Silver Palladium Alloy Contacts},
year={2007},
volume={E90-C},
number={7},
pages={1405-1411},
abstract={In this paper, a method of separating the effects of the thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of AgPd contacts was proposed. First, the effects of the Pd content on the durations and integral powers of the bridge and arc, and the temperature rise of the contacts were discussed. Because the integral power of bridge was larger than that of the arc under our experimental conditions of 40 V open-circuit, 5 A close-circuit and 100 µm/s opening velocity, the temperature rise of the contacts was dominated by the bridge. No remarked difference in bridge duration can be seen among the six materials. Although the integral power of the bridge in the case of Pd was maximum, the maximum temperature rise of the contact was observed in the case of AgPd₆₀. To clarify the contribution of each factor, the effect of thermal diffusivity on the temperature rise of the contact was evaluated by the finite-difference time-domain (FDTD) method. In the case of Pd, because its thermal diffusivity was largest, heat diffused rapidly. On the other hand, the thermal diffusivity in the case of AgPd₆₀ was small, and heat diffused slowly to the holders. The maximum temperature rise was observed in the case of AgPd₆₀. It was demonstrated that the proposed method of separating the effects of thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of contacts is effective in enabling us to understand contact phenomena.},
keywords={},
doi={10.1093/ietele/e90-c.7.1405},
ISSN={1745-1353},
month={July},}

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TY - JOUR
TI - Effect of the Thermal Constant on Temperature Rise of Silver Palladium Alloy Contacts
T2 - IEICE TRANSACTIONS on Electronics
SP - 1405
EP - 1411
AU - Kazuaki MIYANAGA
AU - Yoshiki KAYANO
AU - Hiroshi INOUE
PY - 2007
DO - 10.1093/ietele/e90-c.7.1405
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E90-C
IS - 7
JA - IEICE TRANSACTIONS on Electronics
Y1 - July 2007
AB - In this paper, a method of separating the effects of the thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of AgPd contacts was proposed. First, the effects of the Pd content on the durations and integral powers of the bridge and arc, and the temperature rise of the contacts were discussed. Because the integral power of bridge was larger than that of the arc under our experimental conditions of 40 V open-circuit, 5 A close-circuit and 100 µm/s opening velocity, the temperature rise of the contacts was dominated by the bridge. No remarked difference in bridge duration can be seen among the six materials. Although the integral power of the bridge in the case of Pd was maximum, the maximum temperature rise of the contact was observed in the case of AgPd₆₀. To clarify the contribution of each factor, the effect of thermal diffusivity on the temperature rise of the contact was evaluated by the finite-difference time-domain (FDTD) method. In the case of Pd, because its thermal diffusivity was largest, heat diffused rapidly. On the other hand, the thermal diffusivity in the case of AgPd₆₀ was small, and heat diffused slowly to the holders. The maximum temperature rise was observed in the case of AgPd₆₀. It was demonstrated that the proposed method of separating the effects of thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of contacts is effective in enabling us to understand contact phenomena.
ER -