3-D CG Media Chip: An Experimental Single-Chip Architecture for Three-Dimensional Computer Graphics

Takao WATANABE; Kazushige AYUKAWA; Yoshinobu NAKAGOME

3-D CG Media Chip: An Experimental Single-Chip Architecture for Three-Dimensional Computer Graphics

Takao WATANABE, Kazushige AYUKAWA, Yoshinobu NAKAGOME

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A single-chip architecture for three-dimensional (3-D) computer graphics (CG) is discussed assuming portable equipment with a 3-D CG interface. Based on a discussion of chip requirements, an architecture utilizing DRAM technology is proposed. A 31-Mbit, on-chip DRAM cell array allows a full-color, 480640-pixel frame with two 3-D frame buffers for double buffering and one 2-D frame buffer for superimposed or background images. The on-chip pixel generator produces R, G, B, and Z data in a triangular polygon with a zigzag-scan interpolation algorithm. The on-chip frame synthesizer combines data from one of the 3-D buffers with that from the 2-D buffer to produce superimposed or background 2-D images within a 3-D CG image. Parallel alpha-blending and Z-comparison circuits attached to the DRAM cell array provide a high data I/O rate. Estimation of the chip performance assuming the 0.35-µm CMOS design rule shows the chip size, the drawing speed, on-chip data I/O rate, and power dissipation would be 1413.5-mm, 0.25 million polygons/s, 1 gigabyte/s, and 590 mW at a voltage of 3.3 V, respectively. Based on circuit simulations, the chip can run on a 1.5-V dry cell with a drawing speed of 0.125 million polygons/s and a power dissipation of 61 mW. A scaled-down version of the chip which has an 1-kbit DRAM cell array with an attached alpha-blending circuit is being fabricated for evaluation.

Publication: IEICE TRANSACTIONS on Electronics Vol.E77-C No.12 pp.1881-1887

Publication Date: 1994/12/25

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Type of Manuscript: Special Section PAPER (Special Issue on Multimedia, Analog and Processing LSIs)

Category: Multimedia System LSIs

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Takao WATANABE, Kazushige AYUKAWA, Yoshinobu NAKAGOME, "3-D CG Media Chip: An Experimental Single-Chip Architecture for Three-Dimensional Computer Graphics" in IEICE TRANSACTIONS on Electronics, vol. E77-C, no. 12, pp. 1881-1887, December 1994, doi: .
Abstract: A single-chip architecture for three-dimensional (3-D) computer graphics (CG) is discussed assuming portable equipment with a 3-D CG interface. Based on a discussion of chip requirements, an architecture utilizing DRAM technology is proposed. A 31-Mbit, on-chip DRAM cell array allows a full-color, 480640-pixel frame with two 3-D frame buffers for double buffering and one 2-D frame buffer for superimposed or background images. The on-chip pixel generator produces R, G, B, and Z data in a triangular polygon with a zigzag-scan interpolation algorithm. The on-chip frame synthesizer combines data from one of the 3-D buffers with that from the 2-D buffer to produce superimposed or background 2-D images within a 3-D CG image. Parallel alpha-blending and Z-comparison circuits attached to the DRAM cell array provide a high data I/O rate. Estimation of the chip performance assuming the 0.35-µm CMOS design rule shows the chip size, the drawing speed, on-chip data I/O rate, and power dissipation would be 1413.5-mm, 0.25 million polygons/s, 1 gigabyte/s, and 590 mW at a voltage of 3.3 V, respectively. Based on circuit simulations, the chip can run on a 1.5-V dry cell with a drawing speed of 0.125 million polygons/s and a power dissipation of 61 mW. A scaled-down version of the chip which has an 1-kbit DRAM cell array with an attached alpha-blending circuit is being fabricated for evaluation.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e77-c_12_1881/_p

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@ARTICLE{e77-c_12_1881,
author={Takao WATANABE, Kazushige AYUKAWA, Yoshinobu NAKAGOME, },
journal={IEICE TRANSACTIONS on Electronics},
title={3-D CG Media Chip: An Experimental Single-Chip Architecture for Three-Dimensional Computer Graphics},
year={1994},
volume={E77-C},
number={12},
pages={1881-1887},
abstract={A single-chip architecture for three-dimensional (3-D) computer graphics (CG) is discussed assuming portable equipment with a 3-D CG interface. Based on a discussion of chip requirements, an architecture utilizing DRAM technology is proposed. A 31-Mbit, on-chip DRAM cell array allows a full-color, 480640-pixel frame with two 3-D frame buffers for double buffering and one 2-D frame buffer for superimposed or background images. The on-chip pixel generator produces R, G, B, and Z data in a triangular polygon with a zigzag-scan interpolation algorithm. The on-chip frame synthesizer combines data from one of the 3-D buffers with that from the 2-D buffer to produce superimposed or background 2-D images within a 3-D CG image. Parallel alpha-blending and Z-comparison circuits attached to the DRAM cell array provide a high data I/O rate. Estimation of the chip performance assuming the 0.35-µm CMOS design rule shows the chip size, the drawing speed, on-chip data I/O rate, and power dissipation would be 1413.5-mm, 0.25 million polygons/s, 1 gigabyte/s, and 590 mW at a voltage of 3.3 V, respectively. Based on circuit simulations, the chip can run on a 1.5-V dry cell with a drawing speed of 0.125 million polygons/s and a power dissipation of 61 mW. A scaled-down version of the chip which has an 1-kbit DRAM cell array with an attached alpha-blending circuit is being fabricated for evaluation.},
keywords={},
doi={},
ISSN={},
month={December},}

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TY - JOUR
TI - 3-D CG Media Chip: An Experimental Single-Chip Architecture for Three-Dimensional Computer Graphics
T2 - IEICE TRANSACTIONS on Electronics
SP - 1881
EP - 1887
AU - Takao WATANABE
AU - Kazushige AYUKAWA
AU - Yoshinobu NAKAGOME
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 12
JA - IEICE TRANSACTIONS on Electronics
Y1 - December 1994
AB - A single-chip architecture for three-dimensional (3-D) computer graphics (CG) is discussed assuming portable equipment with a 3-D CG interface. Based on a discussion of chip requirements, an architecture utilizing DRAM technology is proposed. A 31-Mbit, on-chip DRAM cell array allows a full-color, 480640-pixel frame with two 3-D frame buffers for double buffering and one 2-D frame buffer for superimposed or background images. The on-chip pixel generator produces R, G, B, and Z data in a triangular polygon with a zigzag-scan interpolation algorithm. The on-chip frame synthesizer combines data from one of the 3-D buffers with that from the 2-D buffer to produce superimposed or background 2-D images within a 3-D CG image. Parallel alpha-blending and Z-comparison circuits attached to the DRAM cell array provide a high data I/O rate. Estimation of the chip performance assuming the 0.35-µm CMOS design rule shows the chip size, the drawing speed, on-chip data I/O rate, and power dissipation would be 1413.5-mm, 0.25 million polygons/s, 1 gigabyte/s, and 590 mW at a voltage of 3.3 V, respectively. Based on circuit simulations, the chip can run on a 1.5-V dry cell with a drawing speed of 0.125 million polygons/s and a power dissipation of 61 mW. A scaled-down version of the chip which has an 1-kbit DRAM cell array with an attached alpha-blending circuit is being fabricated for evaluation.
ER -