A Buried-Channel Self-Aligned GaAs MESFET with High Power-Efficiency and Low Noise-Figure for 1.9-GHz Single-Chip Front-End MMICs

Kazuya NISHIHORI, Atsushi KAMEYAMA, Yoshiaki KITAURA, Yoshikazu TANABE, Masakatsu MIHARA, Misao YOSHIMURA, Mayumi HIROSE, Naotaka UCHITOMI

  • Full Text Views

    0

  • Cite this

Summary :

We report on 1.9-GHz performance of the Buried-Channel self-aligned WN/W-gate GaAs MESFET (BC-MESFET) for use in digital mobile telephone handsets with low power consumption. The BC-MESFET incorporates undoped i-GaAs epitaxial-grown surface layer on the ion-implanted channel. Both the power and noise performance of the BC-MESFET are superior to the conventional MESFET. The 0.6-µm gate power BC-MESFET exhibits a high power-added efficiency of 57% at 1-dB gain compression, which leads to low power dissipation of the handset. This power performance is attributed to high breakdown voltage which the undoped i-GaAs surface layer has brought about. The BC-MESFET has also shown a minimum noise figure of below 0.4 dB. Taking the IC-oriented fabrication process of the BC-MESFET into consideration, these FET performances demonstrate that the BC-MESFET is suitable for the single-chip MMIC that integrates RF front-end blocks for the 1.9-GHz small-size mobile telephone handset with long battery lifetime.

Publication
IEICE TRANSACTIONS on Electronics Vol.E80-C No.12 pp.1586-1591
Publication Date
1997/12/25
Publicized
Online ISSN
DOI
Type of Manuscript
Special Section PAPER (Special Issue on Low-Power and High-Speed LSI Technologies)
Category

Authors

Keyword

FlyerIEICE has prepared a flyer regarding multilingual services. Please use the one in your native language.