A GaAs power MESFET amplifier with a low-distortion, 10-dB gain-variable attenuator has been developed for 1. 9-GHz Japanese personal handy phone system (PHS). Independently of its gain, a very low 600-kHz adjacent channel leakage power (ACP) with sufficient output power was attained. In single low 2. 4-V supply operation, an output power of 21. 1 dBm, a low dissipated current of 157 mA and a high power-added efficiency (PAE) of 37. 2% were obtained with an ACP of -55 dBc.

A GaAs power amplifier IC has been developed for 1. 9-GHz digital mobile communication applications, such as the handsets of the Japanese personal handy phone system (PHS), which was assembled into a very small 0. 012-cc surface mount plastic package. This power amplifier using refractory WNx/W self-aligned gate MESFETs with p-pocket layers can operate with high efficiency and low distortion with a single 3-V supply. A very low dissipated current of 119 mA was obtained with an output power of 21. 1 dBm and a low 600-kHz adjacent channel leakage power (ACP) of -63 dBc for π/4-shifted quadrature phase shift keying (QPSK) modulated input.

We report on 1.9-GHz performance of the Buried-Channel self-aligned WN/W-gate GaAs MESFET (BC-MESFET) for use in digital mobile telephone handsets with low power consumption. The BC-MESFET incorporates undoped i-GaAs epitaxial-grown surface layer on the ion-implanted channel. Both the power and noise performance of the BC-MESFET are superior to the conventional MESFET. The 0.6-µm gate power BC-MESFET exhibits a high power-added efficiency of 57% at 1-dB gain compression, which leads to low power dissipation of the handset. This power performance is attributed to high breakdown voltage which the undoped i-GaAs surface layer has brought about. The BC-MESFET has also shown a minimum noise figure of below 0.4 dB. Taking the IC-oriented fabrication process of the BC-MESFET into consideration, these FET performances demonstrate that the BC-MESFET is suitable for the single-chip MMIC that integrates RF front-end blocks for the 1.9-GHz small-size mobile telephone handset with long battery lifetime.

A monolithic linear power amplifier IC operating with a single low 2.7-V supply has been developed for 1.9-GHz digital mobile communication systems, such as the Japanese personal handy phone system (PHS). Refractory WNx/W self-aligned gate GaAs power MESFETs have been successfully developed for L-band power amplification, and this power amplifier operates with high efficiency and low distortion at a low voltage of 2.7 V, without any additional negative voltage supply, by virtue of small drain knee voltage, high transconductance and sufficient breakdown voltage of the power MESFET. An output power of 23.0 dBm and a high power-added efficiency of 30.8% were attained for 1.9-GHz π/4-shifted QPSK (quadrature phase shift keying) modulated input when adjacent channel leakage power level was less than -60 dBc at 600 kHz apart from 1.9 GHz.

We have developed a GaAs direct-conversion π/4 shifted QPSK modulator IC equipped with variable attenuators for controlling the output power level of the 1.9 GHz Personal Handy Phone system in Japan (PHS). The IC was successfully demonstrated showing state-of-the-art performance with the image rejection ratio of more than 36 dBc at a low input power of -10 dBm in 1.9 GHz frequency range. By using the "Gate Current Control method by Pull-down FET's" (GCCPF), the equipped attenuators vary the output power from 0 dB to -28 dB by 4 dB step. The IC operates at a 2.7 V supply with power dissipation of 259 mW. The 2.64.6 mm2 chip with about 400 elements was fabricated by a 0.5 µm WNx-gate BPLDD GaAs MESFET process.

A GaAs SPDT switch IC operating at a low power supply voltage of 2.7 V has been developed for use in 1.9 GHz band personal handy phone system (PHS). In combination with MESFETs with low on-resistance and high breakdown voltage, the switch IC adopts parallel-LC resonant circuits and utilizes both stacked FETs and an additional shunt capacitor at the receiver side in order to realize low insertion loss, high isolation and low distortion characteristics. An insertion loss of 0.55 dB and an isolation of 35.8 dB were obtained at 1.9 GHz. The IC also achieved an output power of 25.0 dBm at 1 dB gain compression point, a second order distortion of -54.3 dBc and an adjacent channel leakage power of -66 dBc at 600 kHz apart from 1.9 GHz at 19 dBm output power.

Two types of circuit architecture for GaAs LSI are described. The first circuit is named Stacked DCFL which has supply voltage compatibility with Si CMOS/BiCMOS and ECL operating on 3 V or 3.3 V. A divide by 128/129 prescaler IC has been developed to confirm the Stacked DCFL circuit operation. The second circuit is named SVFL which operates on single supply voltage by using Schottky FET characteristics in spite of normally-on FET logic. Both circuit architectures are based on the virtual ground concept. The transition time of 45 psec was obtained by the SVFL ring oscillator circuit fabricated with 1 µm gate length FET process, and the transition time of DCFL using the same process was from 80 psec to 100 psec. Stacked DCFL and SVFL are candidates for an internal gate and an input/output interface circuit for GaAs ASIC, respectively.

A GaAs linear power amplifier operating with a single 3-V supply has been developed for 5.8-GHz ISM band applications. Two kinds of refractory WNx/W self-aligned gate MESFETs, a P-pocket MESFET and an asymmetric MESFET with a buried p-layer (BP- MESFET ) have been compared in terms of DC characteristics, small signal characteristics and power performances at 5.8 GHz. To obtain both high gain and high efficiency in the case of single 3-V supply operation at 5.8 GHz, we used a highly efficient and linear P-pocket MESFET for the output-stage power FET and a high-gain asymmetric MESFET with a buried p-layer (BP- MESFET ) for the driver-stage FET. The bias condition for 1-mm output-stage P-pocket MESFET was set near class-AB, so as to obtain sufficient output power with high PAE. The two-stage power amplifier MMIC module which can include all matching and biasing circuits, has been designed and fabricated. The amplifier exhibits a high power gain of 17.9 dB and a high power-added efficiency of 25.7% with a sufficient output power of 18.7 dBm at the 1-dB compression point. This self-aligned gate GaAs MESFET technology is promising for near-future 5.8-GHz applications, because of such good power performance and good mass-producibility.