We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.

An MPEG2 video decoder LSI fully compliant with MPEG2 main profile at main level is described. The video decoder LSI is a single chip solution which can implement MPEG2 video decoding with conventional DRAMs. The LSI features an architecture based on dedicated decoding hardware so as to gain the necessary computational power for real-time processing of ITU-R R.601 size video. The variable length decoder (VLD), owing to our "one symbol decoding in one cycle" policy and a special circuit for detecting unique startcodes, achieved bitstream decoding up to 18 Mbps with a normal decoding process. It also realized fast searching for the next start-code in the picture skipping and error recovery processes. The video decoder LSI also features a hierarchical and adaptive control mechanism. This control mechanism decreases the dead time of the decoding circuits and raises the efficiency of data transfer via the local DRAM port. It also contributes to the realization of error concealment and error recovery processes. This chip is capable of processing NTSC-resolution video depicted in MPEG2 MP＠ML in real-time at 27 MHz operation. The chip integrates about 1200 K transistors using 0.5 µm double metal CMOS technology. The feature of the hardware based architecture results in a low power dissipation, and the chip consumes a 1.4 W of power at 3.3 V supply voltage and is housed in a plastic QFP.