This paper describes a new soft-error-immune SICOS upward transistor memory cell suitable for ultra-high-speed bipolar RAMs. A cell size of 180 µm2, significantly smaller than the 500 µm2 in the conventional upward transistor cell, is achieved by marging an upward transistor and a Shottky barrier diode. A new very thin polysilicon resistor and 0.5-µm U-groove isolated SICOS technology are used to furher reduce cell size. The memory cell is about 105 times as immune to soft errors as downward transistor cells. A simulation shows that a 256-Kbit RAM with a write cycle time below 3 ns can be made using this memory cell.

Recent high-speed bipolar technologies based on SICOS (Sidewall Base Contact Structure) transistors are reviewed. Bipolar device structures that include polysilicon are key technologies for improving circuit characteristics. As the characteristics of the upward operated SICOS transistors are close to those of downward transistors, they can easily be applied in memory cells which have near-perfect soft-error-immunity. Newly developed process technologies for making shallow base and emitter junctions to improve circuit performance are also reviewed. Finally, complementary bipolar technology for low-power and high-speed circuits using pnp transistors, and a quasi-drift base transistor structure suitable for below 0.1 µm emitters are discussed.