An analytic equation was derived for the time jitter of digital NRZ signals due to inter-symbol interference in the PCB transmission lines loaded by DRAM chips which are located in uniform spacing. The inter-symbol interference is caused by a low-pass filtering effect of the loaded transmission line. Good agreements were observed between the equation and measurements with an average error of 17.5%.

A CMOS DFE (decision feedback equalization) receiver with a clock-data skew compensation was implemented for the SSTL (stub-series terminated logic) SDRAM interface. The receiver consists of a 2 way interleaving DFE input buffer for ISI reduction and a X2 over-sampling phase detector for finding the optimum sampling clock position. The measurement results at 1.2 Gbps operation showed the increase of voltage margin by about 20% and the decrease of time jitter in the recovered sampling clock by about 40% by equalization in an SSTL channel with 2 pF 4 stub load. Active chip area and power consumption are 3001000 µm2 and 142 mW, respectively, with a 2.5 V, 0.25 µm CMOS process.

A fully on-chip open-drain CMOS output driver was designed for high bandwidth DRAMs, such that its output voltage swing was insensitive to the variations of temperature and supply voltage. An auto refresh signal was used to update the contents of the current control register, which determined the transistors to be turned-on among the six binary-weighted transistors of an output driver. Because the auto refresh signal is available in DRAM chips, the output driver of this work does not require any external signals to update the current control register. During the time interval while the update is in progress, a negative feedback loop is formed to maintain the low level output voltage (VOL) to be equal to the reference voltage (VOL.ref) which is generated by a low-voltage bandgap reference circuit. Test results showed the successful operation at the data rate up to 1 Gb/s. The worst-case variations of VOL.ref and VOL of the proposed output driver were measured to be 2.5% and 7.5% respectively within a temperature range of 20 to 90 and a supply voltage range of 2.25 V to 2.75 V, while the worst-case variation of VOL of the conventional output driver was measured to be 24% within the same ranges of temperature and supply voltage.

A fully on-chip current controlled open-drain output driver using a bandgap reference current generator was designed for high bandwidth DRAMs. It reduces the overhead of receiving a digital code from an external source for the compensation of the temperature and supply voltage variations. The correct value of the current control register is updated at the end of every auto refresh cycle. The operation at the data rate up to 0.8 Gb/s was verified by SPICE simulation using a 0.22 µm triple-well CMOS technology.