This paper describes a design and application method of multiple chip module (MCM) technology into microwave applications. An X-Band transmit and receive (T/R) module that has high volume production capability is described. The MMIC chip set designed to achieve multiple functions and state of the arts performance is also described. Peak performance between 8. 5 and 10. 5 GHz includes a power output of 8 W, a noise figure of 6 dB, 23 dB of receive and transmit gains, and a 5-bit phase shifter with less than 5. 5 degree rms phase error. The MCM based module utilizes advanced packaging technique, resulting in a highly integrated and mass production capability.