An Application of the MCM Technology into an MMIC T/R Module for Phased Array Antennas

Kohei FUJII; Yasuhiko HARA; Yuzo SHIBUYA; Yuji TAKANO; Taturo SAKAI

An Application of the MCM Technology into an MMIC T/R Module for Phased Array Antennas

Kohei FUJII, Yasuhiko HARA, Yuzo SHIBUYA, Yuji TAKANO, Taturo SAKAI

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This paper describes a design and application method of multiple chip module (MCM) technology into microwave applications. An X-Band transmit and receive (T/R) module that has high volume production capability is described. The MMIC chip set designed to achieve multiple functions and state of the arts performance is also described. Peak performance between 8. 5 and 10. 5 GHz includes a power output of 8 W, a noise figure of 6 dB, 23 dB of receive and transmit gains, and a 5-bit phase shifter with less than 5. 5 degree rms phase error. The MCM based module utilizes advanced packaging technique, resulting in a highly integrated and mass production capability.

Publication: IEICE TRANSACTIONS on Electronics Vol.E81-C No.6 pp.819-826

Publication Date: 1998/06/25

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Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)

Category: Functional Modules and the Design Technology

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Kohei FUJII, Yasuhiko HARA, Yuzo SHIBUYA, Yuji TAKANO, Taturo SAKAI, "An Application of the MCM Technology into an MMIC T/R Module for Phased Array Antennas" in IEICE TRANSACTIONS on Electronics, vol. E81-C, no. 6, pp. 819-826, June 1998, doi: .
Abstract: This paper describes a design and application method of multiple chip module (MCM) technology into microwave applications. An X-Band transmit and receive (T/R) module that has high volume production capability is described. The MMIC chip set designed to achieve multiple functions and state of the arts performance is also described. Peak performance between 8. 5 and 10. 5 GHz includes a power output of 8 W, a noise figure of 6 dB, 23 dB of receive and transmit gains, and a 5-bit phase shifter with less than 5. 5 degree rms phase error. The MCM based module utilizes advanced packaging technique, resulting in a highly integrated and mass production capability.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e81-c_6_819/_p

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@ARTICLE{e81-c_6_819,
author={Kohei FUJII, Yasuhiko HARA, Yuzo SHIBUYA, Yuji TAKANO, Taturo SAKAI, },
journal={IEICE TRANSACTIONS on Electronics},
title={An Application of the MCM Technology into an MMIC T/R Module for Phased Array Antennas},
year={1998},
volume={E81-C},
number={6},
pages={819-826},
abstract={This paper describes a design and application method of multiple chip module (MCM) technology into microwave applications. An X-Band transmit and receive (T/R) module that has high volume production capability is described. The MMIC chip set designed to achieve multiple functions and state of the arts performance is also described. Peak performance between 8. 5 and 10. 5 GHz includes a power output of 8 W, a noise figure of 6 dB, 23 dB of receive and transmit gains, and a 5-bit phase shifter with less than 5. 5 degree rms phase error. The MCM based module utilizes advanced packaging technique, resulting in a highly integrated and mass production capability.},
keywords={},
doi={},
ISSN={},
month={June},}

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TY - JOUR
TI - An Application of the MCM Technology into an MMIC T/R Module for Phased Array Antennas
T2 - IEICE TRANSACTIONS on Electronics
SP - 819
EP - 826
AU - Kohei FUJII
AU - Yasuhiko HARA
AU - Yuzo SHIBUYA
AU - Yuji TAKANO
AU - Taturo SAKAI
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E81-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1998
AB - This paper describes a design and application method of multiple chip module (MCM) technology into microwave applications. An X-Band transmit and receive (T/R) module that has high volume production capability is described. The MMIC chip set designed to achieve multiple functions and state of the arts performance is also described. Peak performance between 8. 5 and 10. 5 GHz includes a power output of 8 W, a noise figure of 6 dB, 23 dB of receive and transmit gains, and a 5-bit phase shifter with less than 5. 5 degree rms phase error. The MCM based module utilizes advanced packaging technique, resulting in a highly integrated and mass production capability.
ER -