This paper presents an efficient algorithm for incremental buffer insertion and module resizing for a full-placed floorplan. Our algorithm offers a method to use the white space in a given floorplan to resize modules and insert buffers, and at the same time keeps the resultant floorplan as close to the original one as possible. Both the buffer insertion and module resizing are modeled as geometric programming problems, and can be solved extremely efficiently using new developed solution methods. The experimental results suggest that the the wire length difference between the initial floorplan and result are quite small (less than 5%), and the global structure of the initial floorplan are preserved very well.

This paper studies the impact of dummy fill for chemical mechanical polishing (CMP)-induced capacitance variation on buffer insertion based on a virtual CMP fill estimation model. Compared with existing methods, our algorithm is more feasible by performing buffer insertion not in post-process but during early physical design. Our contributions are threefold. First, we introduce an improved fast dummy fill amount estimation algorithm based on [4], and use some speedup techniques (tile merging, fill factor and amount assigning) for early estimation. Second, based on some reasonable assumptions, we present an optimum virtual dummy fill method to estimate dummy position and the effect on the interconnect capacitance. Then the dummy fill estimation model was verified by our experiments. Third, we use this model in early buffer insertion after layer assignment considering the effects of dummy fill. Experimental results verified the necessity of early dummy fill estimation and the validity of our algorithm. Buffer insertion considering dummy fill during early physical design is necessary and our algorithm is promising.

Buffer insertion plays a great role in modern global interconnect optimization. But too many buffers exhaust routing resources, and result in the rise of the power dissipation. Unfortunately, simplified delay models used by most of the present buffer insertion algorithms may introduce redundant buffers due to the delay estimation errors, whereas accurate delay models expand the solution space significantly, resulting in unacceptable runtime. Moreover, the power dissipation problem becomes a dominant factor in the state-of-the-art IC design. Not only transistor but also interconnect should be taken into consideration in the power calculation, which makes us have to use an accurate power model to calculate the total power dissipation. In this paper, we present two stochastic optimization methods, simulated annealing and solution space smoothing, which use accurate delay and power models to construct buffered routing trees with considerations of buffer/wire sizing, routing obstacles and delay and power optimization. Experimental results show our methods can save much of the buffer area and the power dissipation with better solutions, and for the cases with pins ≤ 15, the runtime of solution space smoothing is tens of times faster.

In nature an unbalanced clock tree exists in a SoC because the clock sinks of IPs have distinct input capacitive loads and internal delays. The construction of a bottom-up RLC clock tree with minimal clock delay and zero skew is crucial to ensure good SoC performance. This study proves that an RLC clock tree construction always has no zero skew owing to skew upward propagation. Specifically, this study proposes the insertion of two unit-size buffers associated with the binary search for a tapping point into each pair of subtrees to interrupt the non-zero skew upward propagation. This technique enables reliable construction of a buffered RLC clock tree with zero skew. The effectiveness of the proposed approach is demonstrated by assessing benchmarks.

In the floorplan design of System-on-Chip (SOC), Buffer Site Approach (BSA) has been used to relax the buffer congestion problem. However, for a floorplan with dominant wide bus, BSA may instead worsen the congestion. Our proposed Enhanced Buffer Site Approach (EBSA) extends existing BSA in a way that buffers of dominant wide bus can be distributed more evenly while reserving the same fast operation speed as BSA does. Experiments have been performed to integrate our model into an iterative floorplanning algorithm, and the results reveal that buffer congestion in a floorplan with dominant wide bus can be much abated.

Timing optimization is an important goal of global routing in deep submicron era. To guarantee the timing performance of the circuit, merely adopting topology optimization becomes inadequate. In this paper, we present an efficient timing-driven global routing algorithm with buffer insertion. Our approach is capable of applying topological-based timing optimization and buffer insertion simultaneously with routablity considerations. Compared with previous works, we efficiently solve the timing issues under a limited buffer usage. The experimental results have demonstrated significant delay improvement within short runtime with very small number of buffers inserted.

In this paper, we propose a floorplanning method for VLSI building block layout. The proposed method produces a floorplan under the timing constraint for a given netlist. To evaluate the wiring delay, the proposed method estimates the global routing cost for each net with buffer insertion and wire sizing. The slicing structure is adopted to represent a floorplan, and the Elmore delay model is used to estimate the wiring delay. The proposed method is based on simulated annealing. To shorten the computation time, a table look-up method is adopted to calculate the wiring delay. Experimental results show that the proposed algorithm performs well for producing satisfactory floorplans for industrial data.

We present an efficient heuristic algorithm to reduce glitch power dissipation in CMOS digital circuits. In this paper, gate sizing is classified into three types and the buffer insertion is classified into two types. The proposed algorithm combines three types of gate sizing and two types of buffer insertion into a single optimization process to maximize the glitch reduction. The efficiency of our algorithm has been verified on LGSynth91 benchmark circuits with a 0.5 µm standard cell library. Experimental results show an average of 69.98% glitch reduction and 28.69% power reduction that are much better than those of gate sizing and buffer insertion performed independently.

This paper presents methods of combining buffer insertion and transistor sizing into a single post-layout optimization. The proposed method considers the tradeoff between upsizing transistors and inserting buffers then chooses the solution with the lowest possible power and area cost. The proposed method is efficient and tunable in that optimality can be traded for compute time.