Soft error jeopardizes the reliability of semiconductor devices, especially those working at low voltage. In recent years, silicon-on-thin-box (SOTB), which is a FD-SOI device, is drawing attention since it is suitable for ultra-low-voltage operation. This work evaluates the contributions of SRAM, FF and combinational circuit to chip-level soft error rate (SER) based on irradiation test results. For this evaluation, this work performed neutron irradiation test for characterizing single event transient (SET) rate of SOTB and bulk circuits at 0.5 V. Using the SBU and MCU data in SRAMs from previous work, we calculated the MBU rate with/without error correcting code (ECC) and with 1/2/4-col MUX interleaving. Combining FF error rates reported in literature, we estimated chip-level SER and each contribution to chip-level SER for embedded and high-performance processors. For both the processors, without ECC, 95% errors occur at SRAM in both SOTB and bulk chips at 0.5 V and 1.0 V, and the overall chip-level SERs of the assumed SOTB chip at 0.5 V is at least 10 x lower than that of bulk chip. On the other hand, when ECC is applied to SRAM in the SOTB chip, SEUs occurring at FFs are dominant in the high-performance processor while MBUs at SRAMs are not negligible in the bulk embedded chips.

This paper describes a soft-error tolerant and margin-enhanced nMOS-pMOS reversed 6T SRAM cell. The 6T SRAM bitcell comprises pMOS access and driver transistors, and nMOS load transistors. Therefore, the nMOS and pMOS masks are reversed in comparison with those of a conventional bitcell. In scaled process technology, The pMOS transistors present advantages of small random dopant fluctuation, strain-enhanced saturation current, and small soft-error sensitivity. The four-pMOS and two-nMOS structure improves the soft-error rate plus operating margin. We conduct SPICE and neutron-induced soft-error simulations to evaluate the n-p reversed 6T SRAM bitcell in 130-nm to 22-nm processes. At the 22-nm node, a multiple-cell-upset and single-bit-upset SERs are improved by 34% and 51% over a conventional 6T cell. Additionally, the static noise margin and read cell current are 2.04× and 2.81× improved by leveraging the pMOS benefits.

This paper presents a proposed NMOS-centered 6T SRAM cell layout that reduces a neutron-induced multiple-cell-upset (MCU) SER on a same wordline. We implemented an 1-Mb SRAM macro in a 65-nm CMOS process and irradiated neutrons as a neutron-accelerated test to evaluate the MCU SER. The proposed 6T SRAM macro improves the horizontal MCU SER by 67–98% compared with a general macro that has PMOS-centered 6T SRAM cells.

This paper presents measurement results of bit error rate (BER) and soft error rate (SER) improvement on 150-nm FD-SOI 7T/14T (7-transistor/ 14-transistor) SRAM test chips. The reliability of the 7T/14T SRAM can be dynamically changed by a control signal depending on an operating condition and application. The 14T dependable mode allocates one bit in a 14T cell and improves the BER in a read operation and SER in a retention state, simultaneously. We investigate its error rate mitigating mechanisms using Synopsys TCAD simulator. In our measurements, the minimum operating voltage was improved by 100 mV, the alpha-induced SER was suppressed by 80.0%, and the neutron-induced SER was decreased by 34.4% in the 14T dependable mode over the 7T normal mode.

This paper describes a soft error hardened latch (SEH-Latch) scheme that has an error correction function in the fine process. The storage node of the latch is separated into three electrodes and a soft error on one node is collected by the other two nodes despite the large amount and long-lasting influx of radiation-induced charges. To achieve this, we designed two types of SEH-Latch circuits and a standard latch circuit using 130-nm 2-well, 3-well, and also 90-nm 2-well CMOS processes. The proposed circuit demonstrated immunity that was two orders higher through an irradiation test using alpha-particles, and immunity that was one order higher through neutron irradiation. We also demonstrated forward body bias control, which improves alpha-ray immunity by 26% for a standard latch and achieves 44 times improvement in the proposed latch.

The effects of α-particle-induced parasitic bipolar current on soft errors in submicron 6-transistor SOI SRAMs were numericaly studied. It was shown that the bipolar current induces soft errors and that there exists a critical quantity which determines the soft error occurrence in the SOI SRAMs. Simulated soft error rates were in the same order as those for bulk SRAMs.