We propose a subthreshold Static Random Access Memory (SRAM) circuit architecture with improved write ability. Even though the circuits can achieve ultra-low power dissipation in subthreshold digital circuits, the performance is significantly degraded with threshold voltage variations due to the fabrication process and temperature. Because the write operation of SRAM is prone to failure due to the unbalance of threshold voltages between the nMOSFET and pMOSFET, stable operation cannot be ensured. To achieve robust write operation of SRAM, we developed a compensation technique by using an adaptive voltage scaling technique that uses an on-chip threshold voltage monitoring circuit. The monitoring circuit detects the threshold voltage of a MOSFET with the on-chip circuit configuration. By using the monitoring voltage as a supply voltage for SRAM cells, write operation can be compensated without degrading cell stability. Monte Carlo simulations demonstrated that the proposed SRAM architecture exhibits a smaller write operation failure rate and write time variation than a conventional 6T SRAM.

An on-chip process, supply voltage, and temperature (PVT) compensation technique for low-voltage CMOS digital circuits was proposed. Because the degradation of circuit performance originates from the variation of the saturation current in transistors, we developed a compensation circuit consisting of a reference current that is independent of PVT variations. The circuit is operated so that the saturation current in digital circuits is equal to the reference current. The operations of the circuit were confirmed by SPICE simulation with a set of 0.35-µm standard CMOS parameters. Monte Carlo simulations showed that the proposed technique effectively improves circuit performance by 71%. The circuit is useful for on-chip compensation to mitigate the degradation of circuit performance with PVT variation in low-voltage digital circuits.

This paper newly estimates the yield suppression for 1.5 V-1 Gbit DRAM caused by threshold voltage variation of MOSFET due to microscopic fluctuations in dopant distributions within the channel region and points out the limitation of the conventional redundancy techniques. The yield suppression is estimated for four main circuit blocks, the memory cell transfer transistor, bit line sense amplifier S/A, I/O line differential amplifier D/A, and the peripheral circuit. It is newly found that for 1.5 V-1 Gbit DRAM due to the effect of the newly estimated threshold voltage variation of MOSFET the bit failures of memory cells become the most dominant failure mode and the failure of D/A which can be ignored for 64 Mbit DRAM level can no longer be neglected. Furthermore, the novel optimized redundancy technique for replacing these failure is described.