A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement

Ming-Hsiang CHO; Guo-Wei HUANG; Chia-Sung CHIU; Kun-Ming CHEN; An-Sam PENG; Yu-Min TENG

doi:10.1093/ietele/e88-c.5.845

A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement

Ming-Hsiang CHO, Guo-Wei HUANG, Chia-Sung CHIU, Kun-Ming CHEN, An-Sam PENG, Yu-Min TENG

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In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.

Publication: IEICE TRANSACTIONS on Electronics Vol.E88-C No.5 pp.845-850

Publication Date: 2005/05/01

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DOI: 10.1093/ietele/e88-c.5.845

Type of Manuscript: Special Section PAPER (Special Section on Microelectronic Test Structures)

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Ming-Hsiang CHO, Guo-Wei HUANG, Chia-Sung CHIU, Kun-Ming CHEN, An-Sam PENG, Yu-Min TENG, "A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement" in IEICE TRANSACTIONS on Electronics, vol. E88-C, no. 5, pp. 845-850, May 2005, doi: 10.1093/ietele/e88-c.5.845.
Abstract: In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.
URL: https://globals.ieice.org/en_transactions/electronics/10.1093/ietele/e88-c.5.845/_p

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@ARTICLE{e88-c_5_845,
author={Ming-Hsiang CHO, Guo-Wei HUANG, Chia-Sung CHIU, Kun-Ming CHEN, An-Sam PENG, Yu-Min TENG, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement},
year={2005},
volume={E88-C},
number={5},
pages={845-850},
abstract={In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.},
keywords={},
doi={10.1093/ietele/e88-c.5.845},
ISSN={},
month={May},}

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TY - JOUR
TI - A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement
T2 - IEICE TRANSACTIONS on Electronics
SP - 845
EP - 850
AU - Ming-Hsiang CHO
AU - Guo-Wei HUANG
AU - Chia-Sung CHIU
AU - Kun-Ming CHEN
AU - An-Sam PENG
AU - Yu-Min TENG
PY - 2005
DO - 10.1093/ietele/e88-c.5.845
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E88-C
IS - 5
JA - IEICE TRANSACTIONS on Electronics
Y1 - May 2005
AB - In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.
ER -