The element-by-element finite element method (EBE-FEM) combined with the preconditioned conjugate gradient (PCG) technique is employed in this paper to calculate the coupling capacitances of multi-level high-density three-dimensional interconnects (3DIs). All capacitive coupling 3DIs can be captured, with the effects of all geometric and physical parameters taken into account. It is numerically demonstrated that with this hybrid method in the extraction of capacitances, an effective and accurate convergent solution to the Laplace equation can be obtained, with less memory and CPU time required, as compared to the results obtained by using the commercial FEM software of either MAXWELL 3D or ANSYS.
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Jianfeng XU, Hong LI, Wen-Yan YIN, Junfa MAO, Le-Wei LI, "Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique" in IEICE TRANSACTIONS on Electronics,
vol. E90-C, no. 1, pp. 179-188, January 2007, doi: 10.1093/ietele/e90-c.1.179.
Abstract: The element-by-element finite element method (EBE-FEM) combined with the preconditioned conjugate gradient (PCG) technique is employed in this paper to calculate the coupling capacitances of multi-level high-density three-dimensional interconnects (3DIs). All capacitive coupling 3DIs can be captured, with the effects of all geometric and physical parameters taken into account. It is numerically demonstrated that with this hybrid method in the extraction of capacitances, an effective and accurate convergent solution to the Laplace equation can be obtained, with less memory and CPU time required, as compared to the results obtained by using the commercial FEM software of either MAXWELL 3D or ANSYS.
URL: https://globals.ieice.org/en_transactions/electronics/10.1093/ietele/e90-c.1.179/_p
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@ARTICLE{e90-c_1_179,
author={Jianfeng XU, Hong LI, Wen-Yan YIN, Junfa MAO, Le-Wei LI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique},
year={2007},
volume={E90-C},
number={1},
pages={179-188},
abstract={The element-by-element finite element method (EBE-FEM) combined with the preconditioned conjugate gradient (PCG) technique is employed in this paper to calculate the coupling capacitances of multi-level high-density three-dimensional interconnects (3DIs). All capacitive coupling 3DIs can be captured, with the effects of all geometric and physical parameters taken into account. It is numerically demonstrated that with this hybrid method in the extraction of capacitances, an effective and accurate convergent solution to the Laplace equation can be obtained, with less memory and CPU time required, as compared to the results obtained by using the commercial FEM software of either MAXWELL 3D or ANSYS.},
keywords={},
doi={10.1093/ietele/e90-c.1.179},
ISSN={1745-1353},
month={January},}
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TY - JOUR
TI - Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique
T2 - IEICE TRANSACTIONS on Electronics
SP - 179
EP - 188
AU - Jianfeng XU
AU - Hong LI
AU - Wen-Yan YIN
AU - Junfa MAO
AU - Le-Wei LI
PY - 2007
DO - 10.1093/ietele/e90-c.1.179
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E90-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2007
AB - The element-by-element finite element method (EBE-FEM) combined with the preconditioned conjugate gradient (PCG) technique is employed in this paper to calculate the coupling capacitances of multi-level high-density three-dimensional interconnects (3DIs). All capacitive coupling 3DIs can be captured, with the effects of all geometric and physical parameters taken into account. It is numerically demonstrated that with this hybrid method in the extraction of capacitances, an effective and accurate convergent solution to the Laplace equation can be obtained, with less memory and CPU time required, as compared to the results obtained by using the commercial FEM software of either MAXWELL 3D or ANSYS.
ER -