A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna

Noriharu SUEMATSU; Satoshi YOSHIDA; Shoichi TANIFUJI; Suguru KAMEDA; Tadashi TAKAGI; Kazuo TSUBOUCHI

doi:10.1587/transele.E95.C.1141

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A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna

Noriharu SUEMATSU, Satoshi YOSHIDA, Shoichi TANIFUJI, Suguru KAMEDA, Tadashi TAKAGI, Kazuo TSUBOUCHI

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A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.

Publication: IEICE TRANSACTIONS on Electronics Vol.E95-C No.7 pp.1141-1146

Publication Date: 2012/07/01

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Online ISSN: 1745-1353

DOI: 10.1587/transele.E95.C.1141

Type of Manuscript: Special Section INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)

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Noriharu SUEMATSU, Satoshi YOSHIDA, Shoichi TANIFUJI, Suguru KAMEDA, Tadashi TAKAGI, Kazuo TSUBOUCHI, "A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna" in IEICE TRANSACTIONS on Electronics, vol. E95-C, no. 7, pp. 1141-1146, July 2012, doi: 10.1587/transele.E95.C.1141.
Abstract: A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/transele.E95.C.1141/_p

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@ARTICLE{e95-c_7_1141,
author={Noriharu SUEMATSU, Satoshi YOSHIDA, Shoichi TANIFUJI, Suguru KAMEDA, Tadashi TAKAGI, Kazuo TSUBOUCHI, },
journal={IEICE TRANSACTIONS on Electronics},
title={A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna},
year={2012},
volume={E95-C},
number={7},
pages={1141-1146},
abstract={A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.},
keywords={},
doi={10.1587/transele.E95.C.1141},
ISSN={1745-1353},
month={July},}

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TY - JOUR
TI - A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna
T2 - IEICE TRANSACTIONS on Electronics
SP - 1141
EP - 1146
AU - Noriharu SUEMATSU
AU - Satoshi YOSHIDA
AU - Shoichi TANIFUJI
AU - Suguru KAMEDA
AU - Tadashi TAKAGI
AU - Kazuo TSUBOUCHI
PY - 2012
DO - 10.1587/transele.E95.C.1141
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E95-C
IS - 7
JA - IEICE TRANSACTIONS on Electronics
Y1 - July 2012
AB - A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.
ER -