This paper proposes a heterogeneous wireless network with handover in the application layer. The proposed network requires no upgrade of wireless infrastructure and mobile terminals to convert the present homogeneous networks to the proposed heterogeneous network. Only installing application programs on the content server side and the mobile terminal side is required. The performance of the proposed network has been evaluated in a field trial using a mobile broadband wireless access (MBWA) air interface with wide coverage and a wireless local area network (WLAN) air interface with high throughput. The field trial results show that the maximum value of the handover outage time is only 170 ms. The proposed heterogeneous wireless network is promising since both high throughput and wide coverage area are attained by a combination of the proposed handover scheme with the present homogeneous wireless networks.

In this paper, we propose a novel baseband (BB) phase shifter (PS) using a fixed-gain-amplifier (FGA) matrix. The proposed BB PS consists of 5 stages of a vector synthesis type FGA matrix with in-phase/quadrature-phase (I/Q) input/output interfaces. In order to achieve low gain variation between phase shift states, 3rd to 5th stages are designed to have a phase shift of +φi and -φi (i=3,4,5). To change between +φi and -φi phase shift states, two FGAs with DC bias in-phase/out-phase switches are used. The two FGAs have the same gain, therefore ideally no gain variation can be achieved. Using this configuration, phase shift error and gain variation caused by process mismatch and temperature variation can be reduced. Fabricated 5-bit BB PS has 3-dB bandwidth of 1.05GHz, root-mean-square (rms) phase errors lower than 2.2°, rms gain variations lower than 0.42dB. Power consumption of the PS core and output buffer are 4.9mW and 14.3mW, respectively. 1-dB compression output power is -12.5dBm. The fabricated PS shows that the total phase shift error and gain variation are within the required accuracy of a 5-bit PS with no requirement of calibration.

In order to realize millimeter-wave (MMW) 3-D system-in-package (SiP) front-end modules, we propose a 60-GHz band copper ball vertical interconnection structure, which interconnects between vertically stacked substrates. The structure enables ICs to be placed between the vertically stacked substrates. Since the diameter of the copper balls must exceed the thickness of the ICs, the distance between the substrates in the modules is larger than that of the flip-chip interconnection widely used in the MMW-band. Therefore, the conventional flip-chip interconnection does not scale for the interconnection between the substrates in MMW 3-D SiP front-end modules. The layout of grounded copper balls and the patterns of inner ground layers in the upper/lower substrates are designed using 3-D electromagnetic field simulation. The designed structure allows less than 1 dB transmission loss up to 71.1 GHz, compared with a through transmission line. The result is verified with fabrication and measurement and confirms the feasibility of MMW 3-D SiP front-end modules.

A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.