A 3.3 V single power-supply 64 Mb flash memory with a DBL programming scheme has been developed and fabricated with 0.4 µm CMOS technology. 50 ns access time and 256 b erase/programming unit-capacity have been achieved by using hierarchical word- and bit-line structures and DBL programming scheme. Furthermore in order to lower operating voltage the HiCR cell is used. The chip size is 19.3 mm13.3 mm.

A design rule relaxation approach is one of the most important requirements for high density DRAMs. The approach relaxes the design rule of a element in comparison with the memory cell size and provides high density DRAMs with the minimum development of a scaled-down MOS structure and a fine patterning lithography process. This paper describes two design rule relaxation approaches, a close-packed folded (CPF) bit-line cell array layout and a Boosted Dual Word-Line scheme. The CPF cell array provides 1.26 times wider active area pitch and maximum 1.5 times wider isolation width. The Boosted Dual Word-Line scheme provides 2n times wider 1st Al pitch on memory cell array, double word-line driver pitch and 1.5 times larger design rule for 1st Al and contacts under 1st Al. Especially wide design rule of the Boosted Dual Word-Line scheme provides several times depth of focus (DOF) for 1st Al wiring which gives several times higher storage node and larger capacitance for capacitor over bit-line (COB) stacked capacitor cells. These approaches are successfully implemented in a 4 Mb DRAM test chip with a 0.91.8 µm2 memory cell.

The number of DRAMs that have adopted hierarchical word-line architecture has increased as developed DRAM memory capacity has increased to more than 64 Mb. Use of the architecture enhances many kinds of DRAM performances, such as access time and fabrication process margin. However, the architecture does cause some problems. This paper describes some kinds of hierarchical word-line circuitries that have been proposed. It also describes a partial subarray activation scheme that is combined with hierarchical word-line and data-line architectures and discusses their potential and required specifications for future multi-giga bit DRAMs.

A crossing charge recycle refresh(CCRR) scheme and a serial charge recycle refresh(SCRR) scheme are proposed for the large capacity DRAMs with hierarchical bit-line architecture to reduce main bit-line charging current. A separated driver sense-amplifier(SDSA) circuit is essential to realize this scheme because it features 11 times shorter charge transfer period than that of conventional sense-amplifiers. These circuits are applied to an experimental 1-Gb DRAM, which achieves reduction of main bit-line charging current to 37.5%.