Different-wavelength distributed feedback laser diodes with integrated modulators (DFB/MODs) are fabricated on a single wafer operate at wavelengths from 1. 52 µm to 1. 59 µm, a range comparable to the expanded Er-doped fiber amplifier gain band. A newly developed field-size-variation electron-beam lithography enables grating pitch to be controlled to within 0. 0012 nm, and narrow-stripe selective metal-organic vapor-phase epitaxy is used to control the bandgap wavelength of laser active layers and modulator absorption layers for each channel. The channel spacing of fabricated 40-channel DFB/MODs is 214 GHz in average with a standard deviation of 0. 39 nm. Very uniform lasing and modulating performances are achieved, such as threshold currents about 10 mA and extinction ratios about 20 dB at -2 V in average. These devices have been used to demonstrate 2. 5-Gb/s transmission over 600 km of a normal fiber with a power penalty of less than 1 dB.

Silicon photonic devices based on silicon photonic wire waveguides are especially attractive devices, since they can be ultra-compact and low-power consumption. In this paper, we demonstrated various devices fabricated on silicon photonic wire waveguides. They included optical directional couplers, reconfigurable optical add/drop multiplexers, 12, 14, 18 and 44 optical switches, ring resonators. The characteristics of these devices show that silicon photonic wire waveguides offer promising platforms in constructing compact and power-saving photonic devices and systems.

One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light sources and silicon substrates, and we fabricated a conceptual model of the proposed system based on the results of those examinations. We also investigated the configurations and characteristics of optical components for the silicon optical interposer: silicon optical waveguides, silicon optical splitters, silicon optical modulators, germanium photodetectors, arrayed laser diodes, and spot-size converters. We then demonstrated the feasibility of the system by fabricating a high-density optical interposer by using silicon photonics integrated with these optical components on a single silicon substrate. As a result, we achieved error-free data transmission at 12.5 Gbps and a high bandwidth density of 6.6 Tbps/cm2 with the optical interposer. We think that this technology will solve the bandwidth bottleneck problem.