MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2 W Balanced Amplifier Multi-Chip Module

Yasushi ITOH; Masatoshi NII; Norio TAKEUCHI; Yoshihiro TSUKAHARA; Hidetoshi KUREBAYASHI

MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2 W Balanced Amplifier Multi-Chip Module

Yasushi ITOH, Masatoshi NII, Norio TAKEUCHI, Yoshihiro TSUKAHARA, Hidetoshi KUREBAYASHI

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This paper describes the design, fabrication, and performance of a C- to Ku-band 2 W balanced amplifier multi-chip module employing an MMIC/Super-MIC/MIC configuration. In this module, single-ended amplifiers, quadrature couplers, and pulsed-drive circuits are fabricated on MMICs, Super-MICs, and MICs, respectively, which show different features in fabrication, performance, size, and cost. With the use of the distinguished features of MMICs, Super-MICs, and MICs, the multi-chip module with high performance, small size, and low cost has been achieved. The MMIC/Super-MIC/MIC-combined module would be a candidate for a variety of multi-chip modules with stringent requirements for performance, size, and cost.

Publication: IEICE TRANSACTIONS on Electronics Vol.E80-C No.6 pp.757-762

Publication Date: 1997/06/25

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Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeterwave High-power Devices)

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Yasushi ITOH, Masatoshi NII, Norio TAKEUCHI, Yoshihiro TSUKAHARA, Hidetoshi KUREBAYASHI, "MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2 W Balanced Amplifier Multi-Chip Module" in IEICE TRANSACTIONS on Electronics, vol. E80-C, no. 6, pp. 757-762, June 1997, doi: .
Abstract: This paper describes the design, fabrication, and performance of a C- to Ku-band 2 W balanced amplifier multi-chip module employing an MMIC/Super-MIC/MIC configuration. In this module, single-ended amplifiers, quadrature couplers, and pulsed-drive circuits are fabricated on MMICs, Super-MICs, and MICs, respectively, which show different features in fabrication, performance, size, and cost. With the use of the distinguished features of MMICs, Super-MICs, and MICs, the multi-chip module with high performance, small size, and low cost has been achieved. The MMIC/Super-MIC/MIC-combined module would be a candidate for a variety of multi-chip modules with stringent requirements for performance, size, and cost.
URL: https://globals.ieice.org/en_transactions/electronics/10.1587/e80-c_6_757/_p

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@ARTICLE{e80-c_6_757,
author={Yasushi ITOH, Masatoshi NII, Norio TAKEUCHI, Yoshihiro TSUKAHARA, Hidetoshi KUREBAYASHI, },
journal={IEICE TRANSACTIONS on Electronics},
title={MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2 W Balanced Amplifier Multi-Chip Module},
year={1997},
volume={E80-C},
number={6},
pages={757-762},
abstract={This paper describes the design, fabrication, and performance of a C- to Ku-band 2 W balanced amplifier multi-chip module employing an MMIC/Super-MIC/MIC configuration. In this module, single-ended amplifiers, quadrature couplers, and pulsed-drive circuits are fabricated on MMICs, Super-MICs, and MICs, respectively, which show different features in fabrication, performance, size, and cost. With the use of the distinguished features of MMICs, Super-MICs, and MICs, the multi-chip module with high performance, small size, and low cost has been achieved. The MMIC/Super-MIC/MIC-combined module would be a candidate for a variety of multi-chip modules with stringent requirements for performance, size, and cost.},
keywords={},
doi={},
ISSN={},
month={June},}

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TY - JOUR
TI - MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2 W Balanced Amplifier Multi-Chip Module
T2 - IEICE TRANSACTIONS on Electronics
SP - 757
EP - 762
AU - Yasushi ITOH
AU - Masatoshi NII
AU - Norio TAKEUCHI
AU - Yoshihiro TSUKAHARA
AU - Hidetoshi KUREBAYASHI
PY - 1997
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E80-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1997
AB - This paper describes the design, fabrication, and performance of a C- to Ku-band 2 W balanced amplifier multi-chip module employing an MMIC/Super-MIC/MIC configuration. In this module, single-ended amplifiers, quadrature couplers, and pulsed-drive circuits are fabricated on MMICs, Super-MICs, and MICs, respectively, which show different features in fabrication, performance, size, and cost. With the use of the distinguished features of MMICs, Super-MICs, and MICs, the multi-chip module with high performance, small size, and low cost has been achieved. The MMIC/Super-MIC/MIC-combined module would be a candidate for a variety of multi-chip modules with stringent requirements for performance, size, and cost.
ER -